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Integrated Decoupling Capacitors using Pb(Zr,Ti)O3 Thin Films

  • D. Dimos (a1), S.J. Lockwood (a1), T.J. Garino (a1), H.N. Al-Shareef (a1) and R.W. Schwartz (a1)...

Abstract

Thin-film decoupling capacitors based on ferroelectric (Pb,La)(Zr,Ti)O3 films are being developed for use in advanced packaging applications. The increased integration that can be achieved by replacing surface-mount capacitors should lead to decreased package volume and improved high-speed performance. For this application, chemical solution deposition is an appropriate fabrication technique since it is a low-cost, high-throughput process. The use of relatively thick Pt electrodes (˜1 μm) to minimize series resistance and inductance is a unique aspect to fabricating these devices. In addition, the important electrical properties are discussed, with particular emphasis on lifetime measurements, which suggest that resistance degradation will not be a severe limitation on device performance. Finally, some of the work being done to develop methods of integrating these thin-film capacitors with ICs and MCMs is presented.

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Integrated Decoupling Capacitors using Pb(Zr,Ti)O3 Thin Films

  • D. Dimos (a1), S.J. Lockwood (a1), T.J. Garino (a1), H.N. Al-Shareef (a1) and R.W. Schwartz (a1)...

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