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In-situ XRD and FIB microscopy studies of the dynamics of intermetallic phase formation in thin layer Cu/Sn films for low-temperature isothermal diffusion soldering

  • Harald Etschmaier (a1) (a2), Jiří Novák (a2), Hannes Eder (a1) and Peter Hadley (a2)

Abstract

In this contribution we report on the dynamics of the phase evolution in electrochemically deposited Sn thin films on copper coated substrates studied by in-situ X-ray diffraction (XRD) and Focused Ion Beam Microscopy (FIB). The data obtained is used to extract fundamental parameters such as the activation energy and the rate constant of the reaction. Results indicate that the formation of intermetallic phases in these thin layers, in which the grain size exceeds the layer thickness, is not limited by diffusion but rather by reaction kinetics.

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1. Jacobson, D. and Sangha, S., Soldering & Surface Mount Technology 8, 1215 (1996).
2. Jacobson, D. and Humpston, G., Soldering & Surface Mount Technology 4, 2732 (1992).
3. Tu, K., Materials Chemistry and Physics 46, 217223.
4. Tu, K., Acta Metallurgica 21, 347354 (1973).
5. Tu, K.N. and Thompson, R.D., Acta Metallurgica 30, 947952 (1982).
6. Kang, S.K., Rai, R.S., and Purushothaman, S., Journal of Electronic Materials 25, 11131120 (1996).
7. Bader, S., Gust, W., and Hieber, H., Acta Metallurgica Et Materialia 43, 329337 (1995).
8. Miric, A.Z. and Grusd, A., Soldering & Surface Mount Technology 10, 1925 (1998).
9. Harris, P.G. and Chaggar, K.S., Soldering & Surface Mount Technology 10, 3852 (1998).
10. Flinn, P.A. and Waychunas, G.A., J. Vac. Sci. Technol. B 6, 17491755 (1988).
11. Massalski, T., (1996).
12. Westgren, A. and Phragmen, G., Z. Anorg. Chem 175, 80 (1928).
13. Dyson, B.F., Appl, J.. Phys. 38, 3408 (1967).
14. Warwick, M.E. and Muckett, S.J., Circuit World 9, 511 (1993).
15. Kay, P. and McKay, C.A., Trans. Inst. Met. Fin. 57, 169 (1979).
16. Kay, P.J. and McKay, C.A., Trans. Inst. Met. Fin. 54, 6874 (1976).
17. Thwaites, C.J., Trans. Inst. Met. Fin. 43, 143 (1965).

Keywords

In-situ XRD and FIB microscopy studies of the dynamics of intermetallic phase formation in thin layer Cu/Sn films for low-temperature isothermal diffusion soldering

  • Harald Etschmaier (a1) (a2), Jiří Novák (a2), Hannes Eder (a1) and Peter Hadley (a2)

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