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In-Situ X-ray Photoemission Spectromicroscopy of Electromigration in Patterned Al-Cu Lines With Maximum

  • H.H. Solak (a1), G.F. Lorusso (a1), S. Singh (a1), F. Cerrina (a1), J.H. Underwood (a2) and P. Batson (a2)...

Abstract

We report the application of a unique photoemission spectromicroscope (MAXIMUM) to the study of electromigration phenomena in Al-Cu interconnects. MAXIMUM is a scanning type photoemission microscope that uses multilayer-coated optics to focus 130 eV x-rays to a sub-0.1 µm spot. An electron energy analyzer collects photoelectrons in a chosen spectral region of interest to form an image of the sample that is sensitive to chemical states of elements on the sample surface. Al-Cu lines were characterized by spectromicroscopy techniques before and after electromigration stressing in the UHV environment of the microscope chamber. We present spectro-micrographs showing the chemical and structural changes on Al-Cu line surfaces as a result of the electromigration process.

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In-Situ X-ray Photoemission Spectromicroscopy of Electromigration in Patterned Al-Cu Lines With Maximum

  • H.H. Solak (a1), G.F. Lorusso (a1), S. Singh (a1), F. Cerrina (a1), J.H. Underwood (a2) and P. Batson (a2)...

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