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The Influence of Temperature and Concentration on Copper Deposition Kinetics in Supercritical Carbon Dioxide

  • Yinfeng Zong (a1) and James J. Watkins (a1)

Abstract

The kinetics of copper deposition by the hydrogen-assisted reduction of bis(2,2,7- trimethyloctane-3,5-dionato)copper in supercritical carbon dioxide was studied as a function of temperature and precursor concentration. The growth rate was found to be as high as 31.5 nm/min. Experiments between 220 °C and 270 °C indicated an apparent activation energy of 51.9 kJ/mol. The deposition kinetics were zero order with respect to precursor at 250 °C and 134 bar and precursor concentrations between 0.016 and 0.38 wt.% in CO2. Zero order kinetics over this large concentration interval likely contributes to the exceptional step coverage obtained from Cu depositions from supercritical fluids.

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The Influence of Temperature and Concentration on Copper Deposition Kinetics in Supercritical Carbon Dioxide

  • Yinfeng Zong (a1) and James J. Watkins (a1)

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