Carbon nanotubes patterns of micron-level resolution have been achieved using inkjet printing of DNA and SDS assisted CNT dispersions. DNA/CNT film has a significantly higher resistance compared to SDS/CNT film. Taking advantage of the porous nature of printed SDS/CNT film after SDS removal, indium can be electroplated to fill the CNT network and form a CNT/In composite. The CNT/In composite was used as interconnect material. Reworkability and RF performance of In-plated CNT bump structures are studied and the results are presented.