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Indentation Fracture Toughness Measurements of Low Dielectric Constant Materials

Published online by Cambridge University Press:  01 February 2011

Dylan J. Morris
Affiliation:
Department of Chemical Engineering and Materials Science, University of Minnesota Minneapolis, MN 55455U.S.A.
Robert F. Cook
Affiliation:
Department of Chemical Engineering and Materials Science, University of Minnesota Minneapolis, MN 55455U.S.A.
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Abstract

The physics and mechanics of a fracture toughness measurement technique for low-k films are described. It has been observed experimentally that it is possible to generate reproducible stable cracks at indentation sites in thin low-k films using cube-corner indentation. The fracture response depends on the film thickness and follows no simple scaling laws. The physics of a model that takes into account the stress fields from indentation and film stress, with particular attention paid to the Poisson's ratio of the film, are described. The model is able to predict the changes in observables when the film thickness is changed, which allows one to estimate film toughness independent of the configuration of the material.

Type
Research Article
Copyright
Copyright © Materials Research Society 2003

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References

1. Lucas, B.N. et al., Mat. Res. Soc. Proc., 436, p. 233, 1997.Google Scholar
2. Lucas, B.N., Oliver, W. C., and Swindeman, J.E., Mat. Res. Soc. Proc., 522, p. 3, 1998.Google Scholar
3. Anstis, G. R. et al., J. Am. Ceram. Soc. 64, p. 533, 1981.Google Scholar
4. Arora, A., Marshall, D.B., Lawn, B.R., and Swain, M.V., J. Non-Cryst. Solids 31, p. 415, 1979 Google Scholar
5. Pharr, G.M., Harding, D.S., and Oliver, W.C., Mechanical Properties and Deformation Behavior of Materials Having Ultra-Fine Microstructures, p. 449, 1993.Google Scholar
6. Morris, D.J. and Cook, R.F., unpublished work.Google Scholar
7. Hay, J.C., Bolshakov, A., and Pharr, G.M., J. Mat. Res 14, p. 2296, 1999.Google Scholar
8. Yoffe, E. H., Phil. Mag. A 46, p. 617, 1982.Google Scholar
9. Chiang, S. S., Marshall, D. B., and Evans, A. G., J. App. Phys. 53, p. 298, 1982.Google Scholar
10. Evans, K.E. and Alderson, A., Phys. Rev. Lett 89, p.225503, 2002.Google Scholar
11. Evans, K.E., Nkansh, M.A., and Hutchinson, I.J., Acta Metall. Mater. 42, p. 1289, 1994.Google Scholar
12. Lawn, B.R., Evans, A.G., and Marshall, D.B., J. Am. Ceram. Soc. 63, p. 574, 1980.Google Scholar
13. Mencik, J. et al., J. Mater. Res. 12, p. 2475, 1997.Google Scholar
14. Beuth, J.L. Jr , Int. J. Solids. Struct. 29, p. 1657, 1992.Google Scholar
15. Dundurs, J., J. Appl. Mech. 36, p. 650, 1969.Google Scholar
16. Zak, A.R. and Williams, M.L., J. Appl. Mech. 30, p. 142, 1963.Google Scholar
17. Suga, T., Elssner, E., and Schmander, S., J. Comp. Mater. 22, p. 917, 1988.Google Scholar
18. Tada, H., Paris, P. C., and Irwin, G. R., The Stress Analysis of Cracks Handbook, ASME Press, 2000.Google Scholar