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In Situ Measurement of Stress. Included During Annealing, in A1-2%Cu Thin Films
Published online by Cambridge University Press: 22 February 2011
Abstract
Stress measurement in thin film systems is discussed and applied to Al-2%Cu filns on SiO2/Si substrates during thermal cycling. Plastic deformation obscrved during compressive stress relaxation is correlated with the formation of hillocks on the metal films. The effect of secondary layers of 10%Ti-90%W on the thermo-mcchanical response of Al films is examined.
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- Copyright © Materials Research Society 1985
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