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Hydrodynamics of a Chemical-Mechanical Planarization Process
Published online by Cambridge University Press: 10 February 2011
Abstract
The flow of a slurry in a CMP process has been investigated. This wafer-scale model provides the three dimensional flow field of the slurry, the spatial distribution of the local shear rate imposed on the wafer surface, and the streamline patterns which reflect the transport characteristics of the slurry.
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- Research Article
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- Copyright © Materials Research Society 2000
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