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High Temperature Performance, Reliability and Simulation of GaAs Mesfets with CVD Diamond Heat Sinks

Published online by Cambridge University Press:  25 February 2011

L. Zhu
Affiliation:
CALCE, Electronic Packaging Center, University of Maryland, College Park, MD 20742.
Pin F. Tang
Affiliation:
CALCE, Electronic Packaging Center, University of Maryland, College Park, MD 20742.
A. Christou
Affiliation:
CALCE, Electronic Packaging Center, University of Maryland, College Park, MD 20742.
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Abstract

An investigation of the temperature stability and high temperature characteristics of GaAs FETs on CVD diamond heat sinks was carried out by modeling the high temperature electrical characteristics for GaAs MESFETs and by experimentally measuring the elevated temperature performance. The thermal characteristics were determined experimentally using infrared microscopy techniques. The thermal measurements by infrared microscopy were correlated with results of a finite element analysis calculation of the GaAs FET thermal distribution. Reliability testing at 230°C resulted in an MTF of approximately 2000 hours.

Type
Research Article
Copyright
Copyright © Materials Research Society 1992

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References

REFERENCES

[1] Fan, M., Christou, A. and Pecht, M., IEEE Trans, on Elec. Dev. ED-39, 1075(1992).CrossRefGoogle Scholar
[2] Shoucair, F. S., Microelectronics Journal, 22(2), 39(1991); IEEE Trans, on Comp., Hyb., and Manuf. Tech, CHMT-9(3) 242(1986).Google Scholar
[3] Shur, Michael, Physics of Semiconductor Devices (Prentice Hall, 1990).Google Scholar
[4] Statz, H., Newman, P., Smith, I. W., Pucel, R. A., and Haus, H. A., IEEE Trans, on Elec. Dev. ED-34(2) 169(1987).CrossRefGoogle Scholar
[5] Wright, John L., Marks, B. W. and Decker, K. D., Seventh IEEE SEMI-THERM symposium temperatures during life tests, 1991, 131.Google Scholar