Skip to main content Accessibility help

High Resolution Observation of Void Motion in Passivated Metal Lines Under Electromigration Stress

  • Michael C. Madden (a1), Edward V. Abratowski (a1), Thomas Marieb (a2) and Paul A. Flinn (a1)


Using a 120 kV STEM equipped with a backscattered electron detector and operated as a conventional SEM. voids in metal lines can be detected through 1 μm of passivation. By applying current to passivated thin metal lines while in the microscope, voids can be observed while electromigration is in progress. Voids move significant distances during electromigration. On at least some occasions. failure of the line is not the result of a void growing until the width of the line is reached. On these occasions, when the size of the void approaches the width of the line. the void breaks up into smaller voids.



Hide All
1. Ainslie, N. G., d'Heurle, F. M., and Wells, O. C.. Appl. Phys. Lett. 20. 173 (1972).
2. Castaño, E., Maiz, J., Flinn, P., and Madden, M., Appl. Phys. Lett. 59, 129 (1991).
3. Besser, P., Madden, M., Flinn, P., submitted to J. Appl. Phys.
4. Levine, E. and Kitcher, J., Proceedings of the 22nd Annual IEEE International Reliability Physics Symposium, USA (1984). p. 242.


Full text views

Total number of HTML views: 0
Total number of PDF views: 0 *
Loading metrics...

Abstract views

Total abstract views: 0 *
Loading metrics...

* Views captured on Cambridge Core between <date>. This data will be updated every 24 hours.

Usage data cannot currently be displayed