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High Photosensitivity Two-Photon Photoresists for Large Area Surface Microstructuring

  • Robert J. DeVoe (a1), Tzu-Chen Lee (a1), Jeremy K. Larsen (a1), David A. Ender (a1), Jennifer J. Sahlin (a1), Craig R. Sykora (a2), Cheryl A. Patnaude (a1), Matthew R. Atkinson (a1), Michael E. Griffin (a1), Brian J. Gates (a1) and David H. Redinger (a1)...


Two-Photon initiated polymerization (TPIP) has shown great promise for fabrication of complex micro- and nano-structures. The method has been used to fabricate such structures over small areas (< 1 mm2) because of slow fabrication speeds and resulting long fabrication times. In order for TPIP to reach practical application in a commercial setting fabrication times need to be reduced by orders of magnitude. We report results on a highly photosensitive initiation system for photoresists based on free radical and cationic polymerization, where photosensitivity is increased 102- to 103-fold compared to previously reported photoinitiation systems. Threshold writing speeds are determined for critical exposure conditions, including laser power, type and concentration of photoinitiation system, and photoresist type. Surface roughness, a critical parameter in applications such as optics and microfluidics, for example, is also used to determine threshold writing speed. The utility of the approach is demonstrated by making a cell phone keypad light guide from a microreplication tool fabricated using the highly photosensitive photoresist.



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