Skip to main content Accessibility help
×
Home

High Photosensitivity Two-Photon Photoresists for Large Area Surface Microstructuring

  • Robert J. DeVoe (a1), Tzu-Chen Lee (a1), Jeremy K. Larsen (a1), David A. Ender (a1), Jennifer J. Sahlin (a1), Craig R. Sykora (a2), Cheryl A. Patnaude (a1), Matthew R. Atkinson (a1), Michael E. Griffin (a1), Brian J. Gates (a1) and David H. Redinger (a1)...

Abstract

Two-Photon initiated polymerization (TPIP) has shown great promise for fabrication of complex micro- and nano-structures. The method has been used to fabricate such structures over small areas (< 1 mm2) because of slow fabrication speeds and resulting long fabrication times. In order for TPIP to reach practical application in a commercial setting fabrication times need to be reduced by orders of magnitude. We report results on a highly photosensitive initiation system for photoresists based on free radical and cationic polymerization, where photosensitivity is increased 102- to 103-fold compared to previously reported photoinitiation systems. Threshold writing speeds are determined for critical exposure conditions, including laser power, type and concentration of photoinitiation system, and photoresist type. Surface roughness, a critical parameter in applications such as optics and microfluidics, for example, is also used to determine threshold writing speed. The utility of the approach is demonstrated by making a cell phone keypad light guide from a microreplication tool fabricated using the highly photosensitive photoresist.

Copyright

References

Hide All
1. Zhang, Y.-L., Chen, Q.-D., Xia, H., Sun, H.-B., Nano Today 5(5), 435448 (2010).
2. Rumi, M., Barlow, S., Wang, J., Perry, J. W., Marder, S. R., Adv. Polym. Sci., Springer-Verlag (2008), vol. 213:1-95
3. Belfield, K. D., Yao, S., Bondar, M. V. Adv. Polym. Sci, Springer-Verlag (2008), vol. 213:97-156.
4. Stocker, M. P., Li, L., Gattass, R. R., Fourkas, J. T., Nature Chem. 3, 223227 (2011); T. S. Hsieh, C. W. B. Ng, K. Narayanan, A. C. A. Wan, J. Ying, Biomater. 31, 7648-7652(2010); K. Obata, J. Koch, U. Hinze, B. N. Chichkov, Opt. Express 18, 17193-17200 (2010).
5. Kato, J., Takeyasu, N., Adachi, Y., Sun, H.-B., Kawata, S. Appl. Phys. Lett. 86(4), 044102 (2005); P. R. Fleming, R. J DeVoe, N. A. Stacey, C. A. Leatherdale, R. D. DeMaster, T. A. Ballen, J. M Florczak, U.S. Patent Appl. Publ. US 2004/0012872 (22 January 2004).
6. Nielson, R., Kaehr, B., Shear, J. B. Small 1(1), 120125 (2009).
7. Reinhardt, B. A., Brott, L. L., Clarson, S. J., Dillard, A. G., Bhatt, J. C., Kannan, R., Yuan, L., He, G. S., Prasad, P. N. Chem. Mater. 10, 18631874 (1998).
8. Leatherdale, C. A., Schardt, C. R., Thompson, D. S., Thompson, W. L., U.S. Patent No. 7 265 161 (4 September 2007).
9. For more detailed description of the exposure apparatus see C. M. Marttila, C. D. Hoyle, C. A. Ender, J. B. Willoughby, R. J. DeVoe, U.S. Patent No. 7 941 013 (10 May 2011).
10. Reiser, A., Photoreactive Polymers: Science and Technology of Resists, J. Wiley and Sons, (1989).

Keywords

Metrics

Full text views

Total number of HTML views: 0
Total number of PDF views: 0 *
Loading metrics...

Abstract views

Total abstract views: 0 *
Loading metrics...

* Views captured on Cambridge Core between <date>. This data will be updated every 24 hours.

Usage data cannot currently be displayed