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High Frequency, High Density Interconnect Using AC Coupling

  • Paul Franzon (a1), Angus Kingon (a1) (a2), Stephen Mick (a1), John Wilson (a1), Lei Luo (a1), Karthik Chandrasakhar (a1), Jian Xu (a1), Salvatore Bonafede (a1), Alan Huffman (a1), Chad Statler (a1) and Richard LaBennett (a1)...


AC Coupled Interconnection (ACCI), in conjunction with buried solder bump technology, provides a method to achieve signal I/O pitches of less than 75 μm and signaling rates greater than 5 Gbps per I/O on integrated circuits, while preserving excellent signal integrity. This paper presents a summary of approaches, status, and discusses material issues important to performance.


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[1] Kühn, S. A., “Vertical Signal Transmission in Three-Dimensional Integrated Circuits by Capacitive Coupling”, 1995 IEEE International Symposium on Circuits and Systems. ISCAS '95, vol 1, 1995, pp 3740.
[2] Salzman, D., Knight, T., “Capacitively Coupled MultiChip Modules,”, Proc. 1994 IEEE Multichip Module Conference, pp. 487494.
[3] Kanda, K., Dwi Antono, D., Ishida, K., Kawaguchi, H., Kuroda, T., Sakurai, T., “1.27 Gbp/s/pin 3mW/pin Wireless Suporconnect Interface Scheme, ISSCC 2003, 10.7.
[4] Mick, S. E., Wilson, J. M., and Franzon, P., “4 Gbps AC Coupled Interconnection,” (invited paper), IEEE Custom Integrated Circuits Conference, May 12–16, 2002, pp. 133140.
[5] Mick, S., Luo, L., Wilson, J., Franzon, P., “Buried solder bump connections for high-density capacitive coupling,” IEEE Electrical Performance of Electronic Packaging, 2002, pp. 205208.
[6] Mick, S., Franzon, P., Huffman, A., “Packaging Technology for AC Coupled Interconnect,” in Proc. I4MAPS flip-chip Symposium, June 2000
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