Circuit patterned nucleation of copper or nickel atoms onto polyimide surface was demonstrated by using ArF excimer laser (λ=193nm) and copper sulfate aqueous solution (CuSO4.5H2O+nH2O), or nickel sulfate aqueous solution (NiSO4–6H2O+nH2O) in an atmospheric pressure. Photo-excited C-H bonds of the polyimide surface were effectively dehydrated with hydrogen atoms which were photodissociated from the water. The dangling bonds of the dehydrated hydrogen atoms were combined with the oxygen and the copper or nickel atoms that were photodissociated by CuSO4 solution or NiSO4 solution. Thus, C-O-Cu bonds or C-O-Ni bonds were formed on the surface. After this copper and nickel substitution, it was carried out onto the nucleated parts by usual electroless plating at 70 °C. In this process, the conductive circuit patterned copper or nickel thin film was deposited on polyimide surface.