Skip to main content Accessibility help

Grain Structure Interaction Between Cold and Hot Sputtered Aluminum Films

  • David L. O'Meara (a1)


The factors affecting the second layer grain structure of a two-aluminum-layer sputtered film were investigated with the use of a computer-aided experimental design and analysis program. A cold aluminum layer followed by a hotter aluminum layer has been described in the literature as a means of improving metal step coverage. Several factors were screened to determine the most important parameters by which the first layer influences the second. The two-layer interactions were determined by using scanning electron microscope (SEM) analysis to measure final grain structures. A model was generated from the experimental results that shows the influence of the first layer grain size on the second layer if the second sputter deposition is made above ∼300°C. The influence increases at higher temperatures. The results will be compared to grain growth models found in the literature.



Hide All
1. Movchan, B.A. and Demchishin, A.V., “Study of the Structure and Properties of Thick Vacuum Condensates of Nickel, Titanium, Tungsten, Aluminum Oxide and Zirconium Dioxide”, Fiz. Met. Metalloved. 28, (1969), p. 653.
2. Thorton, J.A., “Influence of Apparatus Geometry and Deposition Conditions on the Structure and Topography of Thick Sputtered Coatings”, J. Vac. Sci. Technol. 11 (4), July/Aug. (1974), p. 666.
3. Srolovitz, D.J., Mazor, A. and Bukiet, B.G., “Analytical and Numerical Modeling of Columnar Evolution in Thin Films”, J. Va. Sci. Technol. A, 6, (4), July/Aug. (1988), p. 2371.
4. Messier, R., Giri, A.P., and Roy, R.A., “Revised Structure Zone Model for Thin Film Physical Structure”, J. Vac. Sci. Technol. A, 2 (2), Apr/June (1984), p. 500.
5. Levenson, L.L., “Grain Boundary Diffusion Activation Energy Derived from Surface Roughness Measurements of Aluminum Thin Films”, Appl. Phys. Left. 55 (25), Dec. (1989), p. 2617.
6. Duffin, R.L., Freeman, J.L., Polito, A., Tracy, C.J., “Reliable Filling of Multilevel Interconnect Vias Using a Multi-step Aluminum Alloy Sputter Deposition”, ECS Spring Extended Abstracts, Vol.90–1, May 1990, p. 235.
7. Pramanik, D., Saxena, A.N., “Aluminum Metallization for ULSI”, Solid State Technology, March 1990, p. 73.
8. Varian 3180 Operations and Process Training Notebook.
9. “Application Note”, Solid State Technology, September (1990), p. 51.

Grain Structure Interaction Between Cold and Hot Sputtered Aluminum Films

  • David L. O'Meara (a1)


Altmetric attention score

Full text views

Total number of HTML views: 0
Total number of PDF views: 0 *
Loading metrics...

Abstract views

Total abstract views: 0 *
Loading metrics...

* Views captured on Cambridge Core between <date>. This data will be updated every 24 hours.

Usage data cannot currently be displayed