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Grain Boundary Sliding in Thin Substrate-Bonded AL Films

  • M. Prieler (a1), H.G. Bohn (a1), W. Schilling (a1) and H. Trinkaus (a1)


A systematic investigation of the anelastic relaxation of thin Al films on Si substrates has been carried out. It was found that both the relaxation in bulk and thin film material can be explained by a model involving glide of grain boundaries (GBs). The mass transport necessary for the glide occurs via GB diffusion in the thin films and via lattice diffusion in the bulk material the different behavior being due to the more of two orders of magnitude smaller grains in the films. Internal friction thus provides a technique to measure diffusional parameters of GB diffusion in thin films.



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