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Future Direction for Materials in Printed Circuit Technology

  • W. T. Chen (a1), W. Lafontaine (a1), J. Brauer (a1) and C. S. Chang (a1)

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1. , Boyko,Bucek, C, F and Markovich, V. (1993), ”Film Redistribution Layer,” Proc. of the 43rd Electronic Components and Technology Conference, IEEE CHMT Society, Orlando Florida, June 1–4, 1993, pp. 302305.
2. , Chen, T., W., , Chang, , C. S., , Charsky, , R.S. (1990) ”Overview of Electrical and Mechanical Aspects of Electronic Packaging” Proc. of 1990 IEEE Int. Symposium of Circuits and Systems, pp. 20852094.
3. Gray, , , F. (1993) ”Multiple PWB Considerations to assemble tomorrow's high I/0 devices” Proc. of the Printed Circuit World Convention VI, May 11 - 14, 1993, pp. M12–1 to M12–23.
4. Heck, H. L., Kresge, J. S., Kolias, J. T. (1993) “High Performance Carrier Technology”, to be published in the Proc. 1993 International Electronic Packaging Conference, September 12–15, 1993, San Diego CA.
5. Heck, H., Houston, T., Knight, J. Mayo, D. (1993) ”IBM MCM-L and MCMD/L Packaging Options using High Density Laminates” presented at the Fall IPC conference, Washington DC, October 1993.
6. Light, , , D. N., McKiever, , , F. J., Tytran, , , C. L, Heck, , H.,(1993) ”High Performance Carrier Technology Materials and Fabrication” to be published in the Proc. of 1993 International Electronic Packaging Conference, September 12–15, 1993, San Diego, CA.
7. Gotro, J. T., Japp, R., Lewis, T. (1993) ”A new Multifunctional High Performance Epoxy Resin for MCM-L applications” presented at the Fall IPC conference, Washington DC, October 1993.
8.. Liu, P.C., Wang, D. W. Livingston, E. D. Chen, W. T. (1993) Proceedings of the ASME International Electronic Packaging Conference Binghamton, New Yor, September 1993
9. Han, , , B. T., and Questad, , D. BM Technical Report, November 1993.r

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