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Free-standing line patterns of nanocrystalline electrodeposits

  • Karen Pantleon (a1), Henrik Myhre Jensen (a2) and Marcel A.J. Somers (a1)

Abstract

Free-standing Cu- and Ni-line patterns with varying line dimensions in the range of a few micrometers were manufactured by means of electrodeposition through a lithographically prepared mask. XRD studies revealed for Cu-lines a pronounced influence of the pattern geometry on crystallographic texture and peak broadening. Information on the strain distribution within individual Cu-lines was obtained from FEM.

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[1] Datta, M., Landolt, D., Electrochimica Acta 45, 2535 (2000).
[2] Andricacos, P.C., Uzoh, C., Dukovic, J.O., Horkans, J., Deligianni, H., IBM J. Res. Develop. 42, 567 (1998).
[3] Buchheit, T.E., LaVan, A.A., Michael, J.R., Christenson, T.R., Leith, S.D., Metallurgical and Materials Transactions 33A, 539 (2002).
[4] Tomov, I.V., Stoychev, D.S., Vitanova, I.B., Journal of Applied Electrochemistry 15, 887 (1985).
[5] Pantleon, K., Jensen, J.A.D., Somers, M.A.J., Journal of The Electrochemical Society 151, C45 (2004).
[6] Pantleon, K., Somers, M.A.J., submitted to Acta materialia (2003).

Free-standing line patterns of nanocrystalline electrodeposits

  • Karen Pantleon (a1), Henrik Myhre Jensen (a2) and Marcel A.J. Somers (a1)

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