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Fracture Strength of Polysilicon thin Films at Stress Concentrations

  • J. Bagdahn (a1) and W. N. Sharpe (a1)

Abstract

The fracture strengths of 3.5 microns thick and 20 or 50 microns wide polysilicon specimens were measured. One set of specimens was straight in the gage section, another set had a central hole 5.0 microns in diameter, and the third set had symmetric semicircular notches 2.5 microns in radius on each side. The local maximum fracture stresses of the non- uniform specimens, as calculated from the remote fracture stress with a stress concentration factor, were higher than measured in the straight specimens. This indicates a size effect, which is presumably due to the smaller highly stressed volume or area in the non-uniform specimens.

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