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Factors Affecting the Mechanical Properties of Cu/Electroless Ni-P/Sn-3.5Ag Solder Joints

  • Aditya Kumar (a1), Zhong Chen (a2), C. C. Wong (a3), S. G. Mhaisalkar (a4) and Vaidhyanathan Kripesh (a5)...

Abstract

This work investigates the factors that affect the mechanical properties of Cu/electroless Ni-P/Sn-3.5Ag solder joints. For the investigation, solder joints were tensile tested after solid-state aging at different temperatures for various durations. Several factors, such as the growth of interfacial compounds (IFCs), Ni3Sn4 morphology, the accumulation of spalled Ni3Sn4 intermetallic particles at the solder/Ni3Sn4 interface, and the formation of Kirkendall voids at the Ni3P/Cu interface, are found to deteriorate the mechanical properties of the joints. Among all these factors, the formation of a layer of Kirkendall voids at the Ni3P/Cu interface, which is a result of Cu diffusion from the interface, causes the most severe decrease in tensile strength with a brittle fracture at the Ni3P/Cu interface. This layer of Kirkendall voids remains the main cause of brittle failure even after the transformation of the Ni3P layer into a Ni-Sn-P layer.

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Keywords

Factors Affecting the Mechanical Properties of Cu/Electroless Ni-P/Sn-3.5Ag Solder Joints

  • Aditya Kumar (a1), Zhong Chen (a2), C. C. Wong (a3), S. G. Mhaisalkar (a4) and Vaidhyanathan Kripesh (a5)...

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