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Fabrication Technologies of Field Emitter Arrays

Published online by Cambridge University Press:  10 February 2011

J. H. Choi
Affiliation:
Materials sector, Display Materials Lab, Samsung Advanced Institute of Technology, P.O. Box 11, Suwon, Korea 440–600, jchoi@saitgw.sait.samsung.co.kr
Y. S. Ryu
Affiliation:
Materials sector, Display Materials Lab, Samsung Advanced Institute of Technology, P.O. Box 11, Suwon, Korea 440–600, jchoi@saitgw.sait.samsung.co.kr
J. H. Kang
Affiliation:
Materials sector, Display Materials Lab, Samsung Advanced Institute of Technology, P.O. Box 11, Suwon, Korea 440–600, jchoi@saitgw.sait.samsung.co.kr
J. E. Jang
Affiliation:
Materials sector, Display Materials Lab, Samsung Advanced Institute of Technology, P.O. Box 11, Suwon, Korea 440–600, jchoi@saitgw.sait.samsung.co.kr
J. M. Kim
Affiliation:
Materials sector, Display Materials Lab, Samsung Advanced Institute of Technology, P.O. Box 11, Suwon, Korea 440–600, jchoi@saitgw.sait.samsung.co.kr
J. P. Hong
Affiliation:
Materials sector, Display Materials Lab, Samsung Advanced Institute of Technology, P.O. Box 11, Suwon, Korea 440–600, jchoi@saitgw.sait.samsung.co.kr
D. Y. Lim
Affiliation:
Materials sector, Display Materials Lab, Samsung Advanced Institute of Technology, P.O. Box 11, Suwon, Korea 440–600, jchoi@saitgw.sait.samsung.co.kr
V. Michine
Affiliation:
Materials sector, Display Materials Lab, Samsung Advanced Institute of Technology, P.O. Box 11, Suwon, Korea 440–600, jchoi@saitgw.sait.samsung.co.kr
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Abstract

Total internal reflection (TIR) holographic lithography is studied as a new method for field emitter array (FEA) fabrication. Four basic parameters of the process - scan speed, laser power, focus distance and step distance, are analyzed to optimize the hole patterns. In addition, the characteristics of the Aluminum (Al) parting layer are studied to minimize the stress produced by Molybdenum (Mo) layer during Spindt-type tip formation process.

Type
Research Article
Copyright
Copyright © Materials Research Society 1997

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References

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