Flexible printed circuits are a technology and product enabler for miniature, high density electronic systems, especially mobile communications and automotive applications. Over the past ten years, flexible printed circuit densities have increased, dramatically, while the area they occupy has decreased. The ever shrinking circuit form factor and increasing I/O and interconnect densities are driving flex circuit configurations from single sided to double sided constructions. In addition, the need for high performance steers circuit construction towards thinner dielectrics. Adhesiveless flex circuit constructions, for example, enable direct metal and lamination bonding without the use of added adhesive materials. Removing adhesive layers, such as epoxies or acrylics allows for a thinner more flexible device with a homogeneous dielectric stack (e.g., all polyimide construction), resulting in superior electrical performance. High resolution flexible circuit processes established using General Electric ULTEM [registered trademark] polyetherimide materials have shown ULTEM resin to have excellent electrical properties including dielectric constant and dissipation factor. Adhesiveless single and double sided flexible circuits have been fabricated and tested for performance (electrical, mechanical, thermal) and reliability (thermal cycling, tear propagation, flexural endurance, and solderability). Critical flex circuit fabrication processes such as metal adhesion, micro-via formation, lamination, photolithography, and module singulation have been evaluated. This paper addresses the key steps for flexible substrate fabrication describing the key advantages and disadvantages of the approach.