Hostname: page-component-7c8c6479df-p566r Total loading time: 0 Render date: 2024-03-19T06:09:28.302Z Has data issue: false hasContentIssue false

Fabrication of 0.1 µm channel diamond Metal-Insulator-Semiconductor Field-Effect Transistor

Published online by Cambridge University Press:  21 March 2011

Hitoshi Umezawa
Affiliation:
School of Science and Engineering, Waseda University, Okubo 3-4-1 Shinjuku-ku, Tokyo 169-8555, Japan CREST, JST (Japan Science and Technology Corporation), Yon ban 5-3, Chiyoda, Tokyo 102-0081, Japan
Yoshikazu Ohba
Affiliation:
School of Science and Engineering, Waseda University, Okubo 3-4-1 Shinjuku-ku, Tokyo 169-8555, Japan CREST, JST (Japan Science and Technology Corporation), Yon ban 5-3, Chiyoda, Tokyo 102-0081, Japan
Hiroaki Ishizaka
Affiliation:
School of Science and Engineering, Waseda University, Okubo 3-4-1 Shinjuku-ku, Tokyo 169-8555, Japan CREST, JST (Japan Science and Technology Corporation), Yon ban 5-3, Chiyoda, Tokyo 102-0081, Japan
Takuya Arima
Affiliation:
School of Science and Engineering, Waseda University, Okubo 3-4-1 Shinjuku-ku, Tokyo 169-8555, Japan CREST, JST (Japan Science and Technology Corporation), Yon ban 5-3, Chiyoda, Tokyo 102-0081, Japan
Hirotada Taniuchi
Affiliation:
School of Science and Engineering, Waseda University, Okubo 3-4-1 Shinjuku-ku, Tokyo 169-8555, Japan CREST, JST (Japan Science and Technology Corporation), Yon ban 5-3, Chiyoda, Tokyo 102-0081, Japan
Minoru Tachiki
Affiliation:
School of Science and Engineering, Waseda University, Okubo 3-4-1 Shinjuku-ku, Tokyo 169-8555, Japan CREST, JST (Japan Science and Technology Corporation), Yon ban 5-3, Chiyoda, Tokyo 102-0081, Japan
Hiroshi Kawarada
Affiliation:
School of Science and Engineering, Waseda University, Okubo 3-4-1 Shinjuku-ku, Tokyo 169-8555, Japan CREST, JST (Japan Science and Technology Corporation), Yon ban 5-3, Chiyoda, Tokyo 102-0081, Japan
Get access

Abstract

Analysis of diamond short channel effect is carried out for the first time. 70 nm channel diamond metal-insulator semiconductor field-effect transistor is realized by utilizing new FET fabrication process on the hydrogen-terminated surface conductive layer. This FET is the shortest gate length in diamond FETs. FETs with thick gate insulator of 35 nm show significant threshold voltage shift and degradation of subthreshold slope S by the gate refining. This phenomenon occurs due to the penetration of drain field into channel. However, the degradation of subthreshold performance and threshold voltage shift are hardly observed in 0.17 µm FET with thin gate insulator 15 nm in thickness.

Type
Research Article
Copyright
Copyright © Materials Research Society 2001

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

[1] Kawarada, H., Aoki, M. and Ito, M., “Enhancement mode metal-semiconductor field-effect transistors using homoepitaxial diamonds”, Appl. Phys. Lett. 65, 1994, pp.15631565.Google Scholar
[2] Maki, T., Shikama, S., Komori, M., Sakaguchi, Y., Sakuta, K. and Kobayashi, T., “Hydrogen Effect of Single-Crystal Diamond Surface”, Jpn. J. Appl. Phys. 31, 1992, pp. L14461449.Google Scholar
[3] Hayashi, K., Yamanaka, S., , H, , Okushi and Kajimura, K., “Study of the effect of hydrogen on transport properties in chemical vapor deposited diamond films by Hall measurements”, Appl. Phys. Lett., 68, 1996, pp.376378.Google Scholar
[4] Kawarada, H., “Hydrogen-terminated diamond surfaces and interfaces”, Surf. Sci. Rep. 26, 1996, pp. 205259.Google Scholar
[5] Umezawa, H., Tsugawa, K., Yamanaka, S., Takeuchi, D., Okushi, H. and Kawarada, H., “ High Performance Diamond Metal Semiconductor Field-Effect Transistor with 1 µm Gate Length”, Jpn. J. Appl. Phys., 38, 1999, pp.L1222-1224Google Scholar
[6] Umezawa, H., Taniuchi, H., Arima, T., Tachiki, M., K. Tsugawa Yamanaka, S., Takeuchi, D., Okushi, H. and Kawarada, H., “Cu/CaF2/Diamond Metal-Insulator-Semiconductor Field-Effect Transistor Utilizing Self-Aligned Gate Fabrication Process”, Jpn. J. Appl. Phys., 39, 2000, pp.L908910.Google Scholar