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Evaluation of Damages and Pore-sealing Capabilities of Oxidizing and Reducing Etch Plasmas for Single and Dual Damascene Patterning of Porous Ultra-Low-k Materials

  • Emmanuel Ollier (a1), Mathieu Clain (a2), Robert Fox (a3), Philippe Brun (a4) and Stephane Jullian (a5)...

Abstract

This paper presents the evaluation of oxidizing and reducing plasmas for post etch pore-sealing treatments during patterning of interconnections in a porous Ultra Low-k (ULK) material. Morphological and chemical characterizations as well as electrical results (resistance, capacitance, leakage, yield) are presented for both single and dual-damascene integrations.

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1 Baklanov, M.R., Le, Q.T., Kesters, E., Iacopi, F., Aelst, J. Van, Struyf, H., Boullart, W., Vanhaelemeersh, S. and Maex, K., IITC Proceedings, pp. 187189 (2004)
2 Arnal, V. et al., ECS Proceedings (ULSI Process Integration), pp. 221224 (2005)
3 Beyer, G., Satta, A., Schumacher, J., Maex, K., Besling, W., Kipela, O., Sprey, H., and Tempel, G., Microelectron. Eng. 64, 233 (2002)
4 Fox, R. et al., IEDM Technical digest, pp. 8790 (2005)
5 Posseme, N., David, T., Meiminger, P., Louveau, O., Chevolleau, T., Joubert, O., Louis, D., Diffusion and Defect Data Part B (Solid State Phenomena) V103–104, pp. 337340 (2005)
6 Hinsinger, O. et al., IEDM Technical Digest, pp.317320 (2004)
7 Struyf, H., Hendrickx, D., Olmen, J. Van, Iacopi, F., Richard, O., Travaly, Y., Hove, M. Van, Boullart, W. and Vanhaelemeersh, S., IITC Proceedings, pp. 3032 (2005)

Keywords

Evaluation of Damages and Pore-sealing Capabilities of Oxidizing and Reducing Etch Plasmas for Single and Dual Damascene Patterning of Porous Ultra-Low-k Materials

  • Emmanuel Ollier (a1), Mathieu Clain (a2), Robert Fox (a3), Philippe Brun (a4) and Stephane Jullian (a5)...

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