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Evaluation of a vertical tube concept for RTP

Published online by Cambridge University Press:  21 February 2011

Byung-Jin Cho ,
Peter Vandenabeele  and
Karen Maex
Byung-Jin Cho
Affiliation:
IMEC Kapeldreef 75, B-3001, Leuven, Belgium
Peter Vandenabeele
Affiliation:
IMEC Kapeldreef 75, B-3001, Leuven, Belgium
Karen Maex
Affiliation:
IMEC Kapeldreef 75, B-3001, Leuven, Belgium
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Abstract

A new RTP system concept is proposed and demonstrated. The system uses a vertical cylindrical quartz tube, while the wafer is placed horizontally. Linear halogen lamps are arranged in an hexagonal shape. Optimal power control results in a temperature difference within ±1.5 °C over a 6 inch wafer in steady state. Oxidation under optimal conditions results in a 1.37% standard deviation for an average oxide thickness of 110.4 Å. The temperature nonuniformity during the transient has been greatly improved by using dynamic control. The main advantages of this new system concept are its excellent temperature uniformity and the good accessibility of the wafer for technological treatments and in situ measurements.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 303: Symposium G – Rapid Thermal and Integrated Processing II , 1993 , 165
Copyright
Copyright © Materials Research Society 1993

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References

REFERENCES

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