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Evaluation of a New Strategy for Transverse Tem Specimen Preparation by Focused-Ion-Beam Thinning

Published online by Cambridge University Press:  10 February 2011

F. Shaapur ,
T. Stark ,
T. Woodward  and
R. J. Graham
F. Shaapur
Affiliation:
NanoTEM, Inc., UltraMetrix Div., 7620 E. McKellips Rd., No. 4109, Scottsdale, AZ 85257
T. Stark
Affiliation:
Materials Analysis Services, Inc., 616 Hutton Street, No. 101. Raleigh. NC 27606
T. Woodward
Affiliation:
Materials Analysis Services, Inc., 616 Hutton Street, No. 101. Raleigh. NC 27606
R. J. Graham
Affiliation:
NanoTEM, Inc., UltraMetrix Div., 7620 E. McKellips Rd., No. 4109, Scottsdale, AZ 85257
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Abstract

In this paper, different variations of a recently developed focused ion beam (FIB)-based TEM specimen preparation technique are studied conceptually and experimentally, compared, and evaluated. This procedure mainly consists of formation, removal, transport, and mounting of an electron transparent transverse membrane on a support grid for TEM study. Based on the experimental results obtained from this evaluation, some modifications have been conceived and implemented. These details as well as other critical information have been presented and discussed.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 480: Symposium Z – Specimen Preparation for Transmission Electron Microscopy…IV , 1997 , 173
Copyright
Copyright © Materials Research Society 1997

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References

1. Basile, D.P., et al., in Specimen Preparation for Transmission Electron Microscopy of Materials, ed. by Anderson, R., et al., Mater. Res. Soc. Proc. 254, Pittsburgh, PA, p. 23, 1992.Google Scholar
2. Overwijk, M.H.F., et al., J. Vac. Sci. Technol. B 11(6), p. 2021, 1993.Google Scholar
3. Herlinger, L.R., et al., in Proceedings of 22nd International Symposium for Testing and Failure Analysis, ed. by Lee, T.W., ASM International, Materials Park, OH, p. 199, 1996.Google Scholar
4. Stevie, F.A., Surf. and Interface Anal. 23, p. 61, 1995.Google Scholar