Hostname: page-component-8448b6f56d-cfpbc Total loading time: 0 Render date: 2024-04-19T23:40:14.684Z Has data issue: false hasContentIssue false
  • English
  • Français

The Energy Release Rate for Decohesion in Thin Multilayered Films on Substrates

Published online by Cambridge University Press:  10 February 2011

Ming. Y. He ,
Guanghai Xu ,
David R. Clarke ,
Qing Ma  and
H. Fujimoto
Ming. Y. He
Affiliation:
Materials Department, University of California, Santa Barbara, CA
Guanghai Xu
Affiliation:
Materials Department, University of California, Santa Barbara, CA
David R. Clarke
Affiliation:
Materials Department, University of California, Santa Barbara, CA
Qing Ma
Affiliation:
Intel Corp., Santa Clara, CA
H. Fujimoto
Affiliation:
Intel Corp., Santa Clara, CA
Get access

Abstract

The strain energy release rates for the converging decohesion crack in a multilayered film on a substrate have been calculated using the finite element method. The results for the energy release rate as a function of the intrinsic stress, the thickness of the superlayer and the modulus ratio will be presented. A simple functional form for the results will be shown. The effects of plasticity of the thin metal layer on the energy release rate have been examined. The results show that the effect of plastic deformation is not significant for the converging decohesion crack. The effects of the line width have also been addressed. The results show that for two-layer films the energy release rate for steady-state decohesion cracks decreases dramatically as B/h decreases, in the range B/h<40, where B is the line width and h is the thickness of the superlayer. For narrow lines the plane strain solutions overestimate the energy release rate. The numerical results are consistent with the experimental observations on lines with different width.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 473: Symposium J – Materials Reliability in Microelectronics VII , 1997 , 15
Copyright
Copyright © Materials Research Society 1997

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

[1] Suo, Z. and Hutchinson, J. W., “Interface crack between two elastic layers”. Int. J. Fract. 431–18, 1990.Google Scholar
[2] Janda, M., “On the intrinsic stress in thin chromium films”. Thin Solid Films. 142, 37–45, 1986.Google Scholar
[3] Xu, G., Ragan, D. D., Clarke, D. R., He, M. Y.., Ma, Q. and Fujimoto, H., “Measurement of the fracture energy of SiO2/TiN interfaces using the residually-stressed thin-film micro-strip test”, to be published in Interface Engineering for Optimized Properties, Mat. Res. Soc. Symp. Proc, Volume 458, 1997 Materials Research Society.Google Scholar