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Electrostatic Adhesion Testing for the Evaluation of Metallization Adhesion

  • H. S. Yang (a1), F. R. Brotzen (a1), D. L. Callahan (a1) and C. F. Dunn (a1)

Abstract

Quantitative measurement of the adhesion strength of thin film metallizations has been achieved by a novel technique employing electrostatic forces to generate delaminating stresses. This technique has been used in testing the adhesion of Al-Cu, Cu, and Al multilayer films deposited on Si. Micro-blister-type failure is revealed by scanning electron microscopy. The delamination process and the geometry of the blister are discussed. The measured adhesion data fit a Weibull distribution function.

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