Hostname: page-component-76fb5796d-zzh7m Total loading time: 0 Render date: 2024-04-25T13:01:01.076Z Has data issue: false hasContentIssue false

The Electrochemistry of Copper in Aqueous Sulphide Solutions

Published online by Cambridge University Press:  21 March 2011

J. Smith
Affiliation:
Department of Chemistry, The University of Western Ontario, London, ON, Canada, N6A 5B7
Z. Qin
Affiliation:
Department of Chemistry, The University of Western Ontario, London, ON, Canada, N6A 5B7
F. King
Affiliation:
Integrity Corrosion Consulting Ltd., 6732 Silverview Drive NW, Calgary, AB, Canada, T3B 3K8
L. Werme
Affiliation:
SKB Swedish Nuclear Fuel and Waste Management Co., Stockholm, Sweden, Box 5864, SE-102 40
D.W. Shoesmith
Affiliation:
Department of Chemistry, The University of Western Ontario, London, ON, Canada, N6A 5B7
Get access

Abstract

Using a variety of electrochemical and surface analytical techniques, the mechanism and kinetics of Cu corrosion in anoxic, aqueous, sulphide-containing environments are being investigated. Under these conditions ([S]total = 10−4 to 3 ×10−3 mol/L), the anodicgrowth ofa film (XRD identifies Cu2S/Cu1.8S as major/minor phases, respectively) is supported by the cathodic reduction of water thereby destabilizing the copper surface. For more oxidizing conditions, the subsequent growth of a partially passivating film is observed. Electrochemical impedance spectroscopy (EIS) and cyclic voltammetry at rotating disc electrodes show film growth occurringwith negligible dissolution and under partial SH- transport control. Current-potentialrelationships as a function of [S]total give Tafel slopes of ∼ (40 mV)−1 suggesting reaction occurs via a 2step process: Aninitial rapid adsorption of SH- leading to an equilibrium surface concentration, followed by a rate determining electron transfer to form a sulphide film. It is proposed thatfilm growth propagates via transport of CuI through the film to the solution interface. The primary goal of this research is the development of a mathematical model which can be used to assess the performance of copper nuclear waste canisters in granitic repositories.

Type
Research Article
Copyright
Copyright © Materials Research Society 2006

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1. King, F.. Mechanistic modeling of the corrosion behaviour of copper nuclear fuel waste Containers. Proceedings of International Conference on Deep Geological Disposal of Radioactive Waste, pg 539 to 5. Canadian Nuclear Society. 1996.Google Scholar
2. Puigdomenech, I. and Taxen, C., SKB Swedish Nuclear Fuel and Waste Management Company Technical Report, TR-00-13 (2000).Google Scholar
3. Pederson, K., Microbial processes in radioactive waste disposal. SKB Swedish Nuclear Fuel and Waste Management Company Technical Report, TR-00-04 (2000).Google Scholar
4. King, F. and Stroes-Gascoyne, S., Proc. 1995 Int. Conf. on MIC, NACE International and American Welding Society, Houston, TX and Miami, FL, 35/1 – 35/14 (1995).Google Scholar
5. Pourbaix, M. and Pourbaix, A., Geochim. Cosmochim. Acta, 56, 3157 (1992).Google Scholar
6. King, F., Swedish Nuclear Fuel and Waste Management Company Technical Report, TR-02-25 (2002)Google Scholar
7. Syrett, B.C., Corros. Sci., 21, 187 (1981).Google Scholar
8. Chialvo, M.R. Gennero de and Arvia, A.J., J. Appl. Electrochem., 15, 685 (1985).Google Scholar
9. Escobar, I., Silva, E., Silva, C., Ubal, A., Proc. ofCopper 99, 371386 (1999).Google Scholar
10. Kelly, R.G., Scully, J.R., Shoesmith, D.W., Buchheit, R.G., Electrochemical Techniques in Corrosion Science and Engineering. Marcel Dekker Inc., New York, 214 (2003).Google Scholar
11. Moll, D. Vasquez, Chialvo, M.R.G. de, Salvarezza, R.C. and Arvia, A.J., Electrochimica Acta, 30, 1011 (1985).Google Scholar