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The Effects of SI Addition on the Properties of AICu Films used in Multilevel Metal Systems

  • S. R. Wilson (a1), D. Weston (a1) and M. Kottke (a1)

Abstract

This paper reports a systematic study of the properties of Al(Cu 0.5-1.5%) and Al(Cu 0.5-1.5%, Si 0.5-1.5%)alloys. The effects of deposition temperatures ranging from room temperature to 475°C were studied as well as whether the films were deposited on Ti-W or SiO2. The Cu and Si profiles were measured as well as the presence of Al2Cu and Si precipitates. The effects of post deposition bake treatments are also discussed.

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7. Hawkins, D.T. and Hultgren, R. Metals Handbook, 8th edition, Lyman, T., ed., (American Society for Metals, Metals Park, Ohio, 1973) p. 259.

The Effects of SI Addition on the Properties of AICu Films used in Multilevel Metal Systems

  • S. R. Wilson (a1), D. Weston (a1) and M. Kottke (a1)

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