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Effects of Pulse Duration and Polarity on the Electromigration Behavior of Copper Interconnects under Pulsed Current Stress

  • Meng Keong Lim (a1), Chee Lip Gan (a2), Yong Chiang Ee (a3), Chee Mang Ng (a4), Bei Chao Zhang (a5) and Juan Boon Tan (a6)...

Abstract

Direct current (D.C.) is usually employed to characterize the electromigration reliability of interconnects. However, D.C. characterization techniques might not reflect the actual reliability of interconnects that are carrying pulsed D.C. or A.C. (alternating current) signals during operation. This study investigates the effects of unipolar and bipolar pulsed current on the electromigration lifetime of copper (Cu) interconnects. A series of long period pulsed current (i.e. 2, 16, 32 and 48 hours) were applied to Cu interconnects. Lifetime enhancement is observed when the half-period of pulsed current is shorter than the medium-time-to-failure (t 50) of D.C. stressed samples. Minor increase in resistance occurring in-between pulses for unipolar pulsed current stressed samples, and occurrence of damage healing in bipolar pulsed current stressed samples are reasons attributed for the observed enhanced lifetime. We obtained longer MTF when the period of the pulsed current is shorter.

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References

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1. Hu, C.-K., Gignac, L. and Rosenberg, R., Microelectronics Reliability 46, pp.213231 (2006).
2. Pierce, D. G. and Brusius, P. G., Microelectron. Reliab. 37, pp.10531072 (1997).
3. Black, J. R., Proc. of 6th Ann. Reliability Physics Symp., pp. 148159 (1967).
4. Hummel, R. E. and Hoang, H. H., J. Appl. Phys. 65, pp.19291931 (1989).
5. Tao, J., Chen, J. F., Cheung, N. W. and Hu, C., Proc. of 34th Ann. Reliability Physics Symp., pp. 180187 (1996).
6. International Technology Roadmap for Semiconductors (2007); see website http://www.itrs.net/
7. Wang, P.-C. and Filippi, R. G., Appl. Phys. Lett. 78, pp.35983600 (2001).
8. Malone, D. W. and Hummel, R. E., J. Appl. Phys. 83, pp.57505760 (1998).
9. Hu, C.-K., Gignac, L., Malhotra, S. G., Rosenberg, R. and Boettcher, S., Appl. Phys. Lett. 78, pp.904906 (2001).
10. Blech, I. A. and Herring, C., Appl. Phys. Lett. 29, pp.131133 (1976).
11. Hau-Riege, C. S., Hau-Riege, S. P. and Marathe, A. P., J. Appl. Phys. 96, pp.57925796 (2004).

Keywords

Effects of Pulse Duration and Polarity on the Electromigration Behavior of Copper Interconnects under Pulsed Current Stress

  • Meng Keong Lim (a1), Chee Lip Gan (a2), Yong Chiang Ee (a3), Chee Mang Ng (a4), Bei Chao Zhang (a5) and Juan Boon Tan (a6)...

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