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Effects of Local Interfacial Debonding on the Stress Evolution in Aluminum Interconnects

Published online by Cambridge University Press:  10 February 2011

Y. -L. Shen
Y. -L. Shen*
Affiliation:
Department of Mechanical Engineering, The University of New Mexico, Albuquerque, NM, 87131, shenyl@slider.unm.edu
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Abstract

The evolution of thermal stresses in aluminum interconnects, with the presence of local debonded areas between the aluminum line and the surrounding dielectric, is studied numerically. Local interfacial debonding is presumably due to contamination during the line patterning process. Various geometrical features of the interconnect and the debond segment are assumed, and the resulting stress fields are examined by recourse to two- and three-dimensional finite element analyses. Implications of the findings to the interconnect reliability, particularly stress-induced voiding in aluminum lines, are discussed.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 473: Symposium J – Materials Reliability in Microelectronics VII , 1997 , 69
Copyright
Copyright © Materials Research Society 1997

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References

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