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Effects of Local Interfacial Debonding on the Stress Evolution in Aluminum Interconnects

  • Y. -L. Shen (a1)

Abstract

The evolution of thermal stresses in aluminum interconnects, with the presence of local debonded areas between the aluminum line and the surrounding dielectric, is studied numerically. Local interfacial debonding is presumably due to contamination during the line patterning process. Various geometrical features of the interconnect and the debond segment are assumed, and the resulting stress fields are examined by recourse to two- and three-dimensional finite element analyses. Implications of the findings to the interconnect reliability, particularly stress-induced voiding in aluminum lines, are discussed.

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Effects of Local Interfacial Debonding on the Stress Evolution in Aluminum Interconnects

  • Y. -L. Shen (a1)

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