Skip to main content Accessibility help

Effects of BEOL Stack on Thermal Mechanical Stress of Cu Lines

  • Seung-Hyun Rhee (a1), Conal E. Murray (a2) and Paul R. Besser (a3)


The measurement and control of the stress state in BEOL interconnects are important to ensure structural integrity and long term reliability of integrated circuits. Thermal stress in interconnects is determined by the thermal-mechanical properties of Cu lines, substrate, and dielectric materials. The effect of BEOL stacks on thermal stress characteristics of Cu lines were investigated using X-ray diffraction stress measurements. The stress characteristics of M1 and M4 level interconnects in full low-k and low-k/oxide hybrid dielectric stacks were evaluated, and the results indicated reduced substrate confinement and an increased impact of the dielectric material on in-plane stresses in higher level interconnects. The effects of dielectric stack and material properties were examined and the implication in the stresses of multilevel interconnects are discussed.



Hide All
[1] Besser, P.R., Joo, Y.-C., Winter, D., Ngo, M. Van, and Ortega, R., Mater. Res. Soc. Symp. Proc. 563, 189 (1999).
[2] Zschech, E. and Besser, P.R., IEEE IITC Proc. 233 (2000).
[3] Gan, D.W., Wang, G., and Ho, P.S., IEEE IITC Proc. 271 (2002).
[4] Paik, J.-M., Jung, J.-K., and Joo, Y.-C., IEEE IRPS Proc. 195 (2005).
[5] Rhee, S.-H., Du, Y., and Ho, P.S., J. Appl. Phys. 93, 3926 (2003).
[6] Zhai, C.J., Besser, P.R., Feustel, F., Marathe, A., and Blish, R.C., Mater. Res. Soc. Symp. Proc. 812 (2004).
[7] Kuschke, W.-M. and Arzt, E., Appl. Phys. Lett. 64, 1097 (1994).
[8] Flinn, P.A. and Chiang, C., J. Appl. Phys. 67, 2927 (1990).
[9] Clemens, B.M. and Bain, J.A., MRS Bull. 17, 46 (1992).
[10] Noyan, I.C. and Cohen, J.B., Residual Stress - Measurement by Diffraction and Interpretation (Springer-Verlag, New York, 1987).
[11] Segmuller, A. and Murakami, M., Treatise on Mater. Sci. and Tech. 27, 143 (1988).
[12] Rhee, S.-H. and Ho, P.S., J. Mater. Res. 18, 848 (2003).
[13] Shen, Y.-L., J. Mater. Res. 12, 2219 (1997).
[14] Kilijanski, M.S. and Shen, Y.-L., Microelectronics Reliability, 42, 259 (2002).


Effects of BEOL Stack on Thermal Mechanical Stress of Cu Lines

  • Seung-Hyun Rhee (a1), Conal E. Murray (a2) and Paul R. Besser (a3)


Full text views

Total number of HTML views: 0
Total number of PDF views: 0 *
Loading metrics...

Abstract views

Total abstract views: 0 *
Loading metrics...

* Views captured on Cambridge Core between <date>. This data will be updated every 24 hours.

Usage data cannot currently be displayed