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Effect of TiN ARC on Electromigration Performance of Tungsten Plug Via

  • Nguyen D. Bui (a1), Van H. Pham (a2), D. David Forsythe (a2), Raymond T. Lee (a2) and John T. Yue (a2)...

Abstract

The effect of TiN Anti-Reflective Coating (ARC) layer capping of metal, in a multilevel interconnect system, on the reliability of the tungsten (W) plug has been investigated. EM study on Kelvin via showed that the thin TiN ARC Kelvin via lifetime exhibited a reduction of one order of magnitude compared to that of the thicker ARC thickness (1000Å) when they were stressed in a certain direction. A new testing technique, used to investigate the effect of ARC thickness on the W-plug electromigration (EM) performance, is discussed. The simulation results of current distribution confirmed the proposed failure model of EM performance of W-plug via with different ARC thickness.

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[1] Wang, Martin S., et al., Symp. on VLSI Technology, p. 41, 1991
[2] Davari, B., et al., IEDM Tech. Dig., p. 61, 1989
[3] Kishimoto, Koji, et al., VMIC Proceedings, p. 149, 1992
[4] Ballance, David S., et al., VMIC Proceedings, p. 180, 1992
[5] Kwork, T., et al., VMIC Proceedings, p. 106, 1990
[6] Estabil, J., et al., VMIC Proceedings, p. 242, 1991
[7] Bui, N., et al., VMIC Proceedings, p. 142, 1990

Effect of TiN ARC on Electromigration Performance of Tungsten Plug Via

  • Nguyen D. Bui (a1), Van H. Pham (a2), D. David Forsythe (a2), Raymond T. Lee (a2) and John T. Yue (a2)...

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