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Effect of Substrate Bias on Structure and Properties of W incorporated Diamond-like Carbon Films

Published online by Cambridge University Press:  15 March 2011

Ai-Ying Wang
Affiliation:
Future Technology Research Division, Korea Institute of Science and Technology, P.O.Box 131, Cheongryang, Seoul, 130-650, South Korea
Kwang-Ryeol Lee
Affiliation:
Future Technology Research Division, Korea Institute of Science and Technology, P.O.Box 131, Cheongryang, Seoul, 130-650, South Korea
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Abstract

W incorporated diamond-like carbon (W-DLC) films were deposited on silicon (100) wafers by a hybrid deposition method combining ion beam deposition of carbon with DC magnetron sputtering of tungsten. During the films deposition, a wide range of negative bias voltage from 0 to -600 V was applied. W concentration in the film could be controlled by varying the Ar/C6H6 ratio in the supplying gas. In the present experimental condition, WC1−x nano-sized particles were not observed in the amorphous carbon matrix. Regardless of the W concentration in the film, it was found that the G-peak position of the Raman spectra had a lowest value at a bias voltage of - 200 V, which represents the highest sp3 bond fraction in the film. The highest residual stress, hardness and Young's modulus were also observed when the bias voltage was -200 V. This result shows that the mechanical properties of W-DLC films were mainly dependent on the atomic bond structure of carbon. On the other hand, the electrical resistivity significantly decreased by the W incorporation.

Type
Research Article
Copyright
Copyright © Materials Research Society 2004

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References

1. Aisenberg, S., Chamot, R., J. Appl. Phys. 42, 2953 (1971).Google Scholar
2. Lee, C.-S., Lee, K.-R., Eun, K. Y., Yoon, K.-H., Han, J.-H., Diamond Relat. Mater. 11, 198 (2002).Google Scholar
3. Zhang, S., Fu, Y. Q., Du, H. J., Zeng, X. T., Liu, Y. C., Surf. Coat. Technol. 162, 42 (2002).Google Scholar
4. Meng, W. J., Gillispie, B. A., J. Appl. Phys. 84, 4314, (1998).Google Scholar
5. Schiffmann, K. I., Fryda, M., Goerigk, G., Lauer, R., Hinze, P., Bulack, A., Thin Solid Films, 347, 60 (1999).Google Scholar
6. Ivanov-Omskii, V. I., Lodygin, A. B., Yastrebov, S. G., Comp. Sci. Technol. 63, 1193 (2003).Google Scholar
7. Yang, S. H., Kong, H., Lee, K. R., Park, S. J., Kim, D. E., Wear, 252, 70 (2002).Google Scholar
8. Zhang, W., Tanaka, A., Wazumi, K., Koga, Y., Thin Solid Films, 416, 145 (2002).Google Scholar
9. Oguri, K., Arai, T., Surf. Coat. Technol. 47, 710(1991).Google Scholar
10. Park, S.-J., Lee, K.-R., Ko, D. H., Eun, K. Y., Diamond Relat. Mater. 11, 1747 (2002).Google Scholar
11. Nie, X., Jiang, J. C., Tung, L. D., Spinu, L., Meletis, E. I., Thin Solid Films, 415, 211 (2002).Google Scholar
12. Chang, Y. Y., Wang, D. Y., Wu, W. T., Thin Solid Films, 420–421, 241 (2002).Google Scholar
13. Zhang, S., Sun, D., Fu, Y. Q., Du, H. J., Surf. Coat. Technol. 167, 113 (2003).Google Scholar
14. Wang, A. Y., Kim, T. Y., Han, J.-H., Lee, K.-R. (to be published).Google Scholar
15. Davis, C. A., Thin Solid Films, 226, 30 (1993)Google Scholar
16. Robertson, J., Mater. Sci. Eng. R, 37, 129(2002)Google Scholar
17. Shin, J.-K., Lee, C.-S., Lee, K.-R., Eun, K. Y., Appl. Phys. Lett. 78, 631 (2001)Google Scholar
18. Ferrari, A. C., Robertson, J., Phy. Rev. B, 61, 14095 (2000)Google Scholar