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Effect Of Nickel In Large Grain Poly-Si Film Formed By Nickel Induced Lateral Crystallization and New Grain Enhancement Method

Published online by Cambridge University Press:  17 March 2011

W.Y. Chan
Affiliation:
Department of Electrical and Electronic Engineering, Hong Kong University of Science & Technology, Sai Kung, Hong Kong
A.M. Myasnikov
Affiliation:
Department of Electrical and Electronic Engineering, Hong Kong University of Science & Technology, Sai Kung, Hong Kong
M.C. Poon
Affiliation:
Department of Electrical and Electronic Engineering, Hong Kong University of Science & Technology, Sai Kung, Hong Kong
C.Y. Yuen
Affiliation:
Department of Electrical and Electronic Engineering, Hong Kong University of Science & Technology, Sai Kung, Hong Kong
P. G. Han
Affiliation:
Department of Electronic Engineering, City University of Hong Kong, Kowloon Tung, Hong Kong
M. Chan
Affiliation:
Department of Electrical and Electronic Engineering, Hong Kong University of Science & Technology, Sai Kung, Hong Kong
P.K. Ko
Affiliation:
Department of Electrical and Electronic Engineering, Hong Kong University of Science & Technology, Sai Kung, Hong Kong
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Abstract

Large grain poly-silicon film (poly-Si) with high material quality and uniformity can have numerous novel applications such as providing a low cost alternative to form silicon-on-insulator (SOI) substrates and a breakthrough technology to ultra-dense 3-dimensional multi-layer SOI like devices and circuits. Nickel Induced Lateral Crystallization (NILC) of amorphous Si (a-Si) has been studied intensively, yet the grains are still small (∼ 1 μm). Recently, we have reported a novel method by combining NILC and a new annealing (at above 900 °C) to form poly-Si film with very large grains ranging from 10 μm to 100 μm. The film has good quality and the TFTs formed are highly comparable to SOI TFTs. This work further reports the effect of Ni to the new large-grain poly-Si film.

Type
Research Article
Copyright
Copyright © Materials Research Society 2000

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References

REFERENCES

1. Jin, Zhonghe, Moulding, Keith, Kwok, Hoi S, Wong, Man, The effects of extended heat treatment on Ni induced lateral crystallization of amorphous silicon thin films, IEEE Transactions on Electron Devices, vol. 46, no. 1, pp. 7881, (1999).Google Scholar
2. Lee, S.W. and Joo, S.K., Low temperature poly-Si thin film transistor fabrication by metal-induced lateral crystallization, IEEE Electron Device Lett., vol. 17, pp. 160162, (1996).Google Scholar
3. Lee, S.W., Jeon, Y.C., and Joo, S.K., Pd induced lateral crystallization of amorphous Si thin films, Appl. Phys, Lett., vol. 66, no. 13, pp. 16711673, (1995).Google Scholar