Hostname: page-component-848d4c4894-8bljj Total loading time: 0 Render date: 2024-07-01T12:03:52.451Z Has data issue: false hasContentIssue false

Effect of Hydrogen Chloride on the Capacitance-Voltage Characteristics of MOCVD-Grown AlN/6H-SiC Mis Structures

Published online by Cambridge University Press:  10 February 2011

C. C. Tin
Affiliation:
Department of Physics, 206 Allison Laboratory, Auburn University, AL 36849, cctin@physics.auburn.edu
A. Gichuhi
Affiliation:
Department of Chemistry, 179 Chemistry Building, Auburn University, AL 36849
M. J. Bozack
Affiliation:
Department of Physics, 206 Allison Laboratory, Auburn University, AL 36849, cctin@physics.auburn.edu
C. G. Shannon
Affiliation:
Department of Chemistry, 179 Chemistry Building, Auburn University, AL 36849
C. K. Teh
Affiliation:
ATA, 2060 Evergreen Drive, Auburn, AL 36830
Get access

Abstract

Aluminum nitride (AlN) is a promising material as gate insulator for 6H-SiC metal-insulator-semiconductor (MlS)-based devices. Using metalorganic chemical vapor deposition (MOCVD)-grown AlN, we have recently fabricated Au/AlN/6H-SiC MIS structures with different AlN/6H-SiC interfacial characteristics depending on the AlN growth procedures. We have also found that the use of hydrogen chloride gas is effective in improving the capacitance-voltage characteristics of the AlN/6H-SiC structure. The reason for such improvement is not well understood and several possible mechanisms for such improvement include factors such as substrate surface morphology and surface contaminants. In this paper, we will examine the relationship between surface morphology of the substrates and the capacitance-voltage characteristics of Au/AlN/6H-SiC structures.

Type
Research Article
Copyright
Copyright © Materials Research Society 1997

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1. Casady, J.B., Cressler, J.D., Dillard, W.C., Johnson, R.W., Agarwal, A.K., and Siergiej, R.R., Solid-State Electronics 39, 777 (1996).Google Scholar
2. Agarwal, A.K., Siergiej, R.R., Seshadri, S., White, M.H., McMullin, P.G., Burk, A.A., Rowland, L.B., Brandt, C.D., and Hopkins, R.H., Mat. Res. Soc. Symp. Proc. 423, 87 (1996).Google Scholar
3. Shenoy, J.N., Chindalore, G.L., Melloch, M.R., Cooper, J.A. Jr, Palmour, J.W., and Irvine, K.G., J. Electronic Mater. 24, 303 (1995).Google Scholar
4. Sridevan, S., Misra, V., McLarty, P.K., Baliga, B.J., and Wortman, J.J., Inst. Phys. Conf. Ser. 142, 645 (1996).Google Scholar
5. Melloch, M.R. and Cooper, J.A. Jr, MRS Bulletin 22, 42 (1997).Google Scholar
6. Harris, C.I., Aboelfotoh, M.O., Kern, R.S., Tanaka, S., and Davis, R.F., Inst. Phys. Conf. Ser. 142, 777 (1996).Google Scholar
7. Zetterling, C-M., Wongchotigul, K., Spencer, M.G., Harris, C.I., Wong, S.S., and Östling, M., Mat. Res. Soc. Symp. Proc. 423, 667 (1996).Google Scholar
8. Tin, C.C., Song, Y., Isaacs-Smith, T., Madangarli, V., and Sudarshan, T.S., J. Electronic Mater. 26, 212 (1997).Google Scholar
9. Kimoto, T., Itoh, A., and Matsunami, H., Appl. Phys. Lett. 66, 3645 (1995).Google Scholar
10. Tiller, W. A., The Science of Crystallization: Microscopic Interfacial Phenomena (Cambridge University Press, Cambridge, 1991), Chap. 2.Google Scholar
11. Tin, C.C., Hu, R., Liu, J., Vohra, Y., and Feng, Z.C., J. Cryst. Growth 158, 509 (1996).Google Scholar