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Effect of Grain Size Distribution on Tensile Properties of Electrodeposited Nanocrystalline Nickel

Published online by Cambridge University Press:  14 March 2011

Fereshteh Ebrahimi
Affiliation:
Materials Science and Engineering Department, University of Florida, Gainesville, FL 32611
Zunayed Ahmed
Affiliation:
Materials Science and Engineering Department, University of Florida, Gainesville, FL 32611
Kristin L. Morgan
Affiliation:
Materials Science and Engineering Department, University of Florida, Gainesville, FL 32611
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Abstract

We have produced dense and ductile nanocrystalline nickel with various grain size distributions using electrodeposition techniques. The strength of the nickel deposits fell within the scatter band of the general Hall-Petch curve for nickel. However, large variations in yield strength, strain hardening rate and tensile elongation were associated with a relatively small change in the average grain size. The scatter in the elongation data has been attributed to the formation of nodules and the presence of voids. The variations in strength and strain hardening rate have been shown to be associated with the changes in the grain size distribution. A model based on confined dislocation motion and composite behavior has been developed for predicting the stress-strain behavior of the nanocrystalline nickel.

Type
Research Article
Copyright
Copyright © Materials Research Society 2001

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References

REFERENCES

1. Ahmed, Z., “Synthesis and Deformation of Nanocrystalline Nickel,” Master thesis, University of Florida, (2000).Google Scholar
2. Wang, N., Wang, Z., Aust, K. T. and Erb, U., Mater. Sci. Eng., 253, 150 (1997).Google Scholar
3. El-Sherik, A. M. and Erb, U., J. Mater. Sci., 30, 5743 (1995).Google Scholar
4. Sanders, P. G., Witney, A. B., Weertman, J. R., Valiev, R. Z. and Siegel, R. W., Mater. Sci. Eng., 204, 7 (1995).Google Scholar
5. Ebrahimi, F., Bourne, G. R., Kelly, M. S. and Matthews, T. E., Nanostructured Materials, 11, 343 (1999).Google Scholar
6. Mitra, R., Ungar, T., Morita, T., Sanders, P. G., and Weertman, J. R., The 1999 J. R. Weertman Symposium, ed. Liaw, P. K. et al. , TMS Publication, Warrendale, PA, 553 (1999).Google Scholar
7. Ebrahimi, F., Zhai, Q. and Kong, D., Scripta Materialia, 39, 315 (1998).Google Scholar
8. Kim, H. S., Estrin, Y. and Bush, M. B., Acta mater., 48, 493 (2000).Google Scholar
9. Embury, J. D. and Hirth, J. P., Acta metall. mater., 42, 2051 (1994).Google Scholar