Hostname: page-component-7bb8b95d7b-lvwk9 Total loading time: 0 Render date: 2024-09-22T06:01:26.917Z Has data issue: false hasContentIssue false
  • English
  • Français

Direct Writing of Copper Lines from Copper Formate Precursors Using a Nd:Yag-Laser

Published online by Cambridge University Press:  21 February 2011

Heinrich G. MOLLER  and
Siegfried Schuler
Heinrich G. MOLLER
Affiliation:
TU Berlin, Forschungsschwerpunkt Mikroperipherik, Sekr. TIP 3.1, Gustav-Meyer-Allee 25, D-1000 Berlin 65
Siegfried Schuler
Affiliation:
TU Berlin, Forschungsschwerpunkt Mikroperipherik, Sekr. TIP 3.1, Gustav-Meyer-Allee 25, D-1000 Berlin 65
Get access

Abstract

An effective method is described for laser induced additive formation of copper conductor lines on alumina substrates. The direct writing process allows for depositions with speeds of up to 50 mm/s and a resolution of about 10 microns with reliable adhesion of the deposited patterns.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 158: Symposium B – In-Situ Patterning: Selective Area Deposition and Etching , 1989 , 169
Copyright
Copyright © Materials Research Society 1990

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1) Gross, M.E., Appelbaum, A., and Gallagher, P.K., J. Appl. Phys. 61, 1628 (1987).Google Scholar
2) Arjavalingam, G., Oprysko, M.M., and Hurst, J.E. Jr, in Laser and Particle-Beam Chemical Processing for Microelectronics, ed. by Ehrlich, D.J., Higashi, G.S., and Oprysko, M.M. (Mater. Res. Soc. Proc. 101, Pittsburgh, PA 1988) pp. 81–87.Google Scholar
3) Gupta, A., Jagannathan, R., in Laser and Particle-Beam Chemical Processing for Microlectronics, ed. by Ehrlich, D.J., Higashi, G.S., and Oprysko, M.M. (Mater. Res. Soc. Proc. 101, Pittsburgh, PA 1988) pp. 94–100.Google Scholar
4) Gupta, A., Jagannathan, R., Appl. Phys. Lett. 5, 2254 (1987).Google Scholar
5) Martin, R.L., Waterman, H., J. Chem. Soc. 1959, 1359.Google Scholar