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Diffusional Processes in Metallurgical Interconnections

Published online by Cambridge University Press:  21 February 2011

S. K. Kang  and
C. G. Woychik
S. K. Kang
Affiliation:
IBM T.J. Watson Research Center, Yorktown Heights, NY
C. G. Woychik
Affiliation:
IBM, System Technology Division, Endicott, NY
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Abstract

Diffusional processes, either solid- or liquid-state, are essential in promoting reliable metallurgical interconnections used in many electronic packaging applications. The same phenomena often degrade the integrity and reliability of the interconnections as well. In this talk, both examples are presented to illustrate how the diffusional processes are important in many interconnection technologies. Thermocompression bonding, eutectic bonding, soldering and liquid-phase bonding are chosen for this purpose. Several issues related to soldering, such as dissolution, intermetallic formation and microstructure of solder joints, will also be discussed in terms of diffusional processes.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 108 , 1987 , 359
Copyright
Copyright © Materials Research Society 1988

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References

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