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Dielectric Properties of UV Cured Thick Film Polymer Networks through High Power Xenon Flash Lamp Curing

  • Brian C. Riggs (a1), Ravinder Elupula (a2), Venkata S. Puli (a1), Scott M. Grayson (a2) and Douglas B. Chrisey (a1)...

Abstract

High-energy flash cure lamps process thick film materials (<10 um) over large areas (<100 cm2) within milliseconds and are capable to deliver higher energy and power densities (20 J/cm2 and 20 kW/cm2) allowing for a more complete curing and elimination of flaws that would exist in conventional treatment. Click reactions are especially attractive for patterned devices as they have minimal shape change during curing and have a more predictable structure compared to free radical acrylate polymerization. Pentaerythritol tetrakis(3-mercaptopropionate) and 2,4,6-Triallyloxy-1,3,5-triazine were combined at 3:4 by weight and then spin coated on copper foil substrates. The solutions were processed both thermally and with exposure to a xenon flash bulb. Thermal treatment consisted of heating the sample at 80°C on a hot plate over night. Flash curing was accomplished using a Novacentrix Pulseforge 1300 system. The flash lamp curing fluence and intensities were varied to determine their effects on degree of cross-linking, dielectric constant, breakdown field and energy storage. The degree of cross-linking was determined through comparative FTIR studies. Dielectric constant was measured using an Agilent 4294a impedance analyzer from 100 Hz-100 MHz with a two terminal setup. Breakdown strength and energy density measurements were taken using Radiant Technology's Precision Ferroelectric tester with a 10 kV source. The printed films averaged 1-3 microns thick as observed by an SEM cross section measurement. It was found that dielectric constant varies with both treatment intensity and fluence. Energy densities were calculated using the ideal capacitor equation and ranged from 1.5-4.8 J/cm3.

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