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Dielectric Properties Of Low Dielectric Constant Polymeric Materials

  • Flora S. Ip (a1) (a2) and Chiu Ting (a1) (a3)


Multilevel interconnects for high performance ULSI need low dielectric constant materials for inter-metal layer dielectric, or ILD, to reduce signal propagation delay, power consumption and cross talk noises. We have studied the physical, dielectric and processing properties of a wide variety of promising low dielectric polymeric materials for ILD applications. This paper presents capacitance values measured over a wide range of temperature, and a summary of the measured dielectric properties. The anisotropy 1,2 of dielectric properties were determined experimentally, the vertical (out-of-plane) dielectric properties were determined by MIM (Metal-Insulator-Metal) measurements, and the horizontal (in-plane) dielectric properties were determined by intra-line measurements of sub-half micron serpentine and comb test structures.



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2. Lin, L., PhD thesis: “Molecular Orientation Studies of Spin-Coated Polyimide Films”, Georgia Institute of Technology, April 1994.
3. Subramanian, et al., “Effect of Moisture on the Physical Properties of Polyimide Films”, MRS Symposium Proceedings, vol.227, pp. 147154.
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5. Schwartz, , Huang, Y-S, Patrick, W., ”The Effective Dielectric Constant of Silicon Dioxides Deposited in the Spaces Between Adjacent Conductors,” J. Electrochem. Soc., Vol.139, 12, pp. 118–122


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