Hostname: page-component-78c5997874-fbnjt Total loading time: 0 Render date: 2024-11-18T07:39:28.300Z Has data issue: false hasContentIssue false
  • English
  • Français

Dielectric Measurements On Printed-Wiring And Circuit Boards, Thin Films, And Substrates: An Overview1

Published online by Cambridge University Press:  15 February 2011

James Baker-Jarvis  and
Chriss A. Jones
James Baker-Jarvis
Affiliation:
Electromagnetic Fields Division, National Institute of Standards and Technology, MS 813.08, Boulder, CO 80303–3328
Chriss A. Jones
Affiliation:
Electromagnetic Fields Division, National Institute of Standards and Technology, MS 813.08, Boulder, CO 80303–3328
Get access

Abstract

A review of the most common methods of permittivity measurements on thin films, printed-wiring and circuit boards, and substrates is presented. Transmission-line techniques, coaxial apertures, open resonators, surface-wave modes, and dielectric resonators methods are examined. The frequency range of applicability and typical uncertainties associated with the methods are summarized.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 381: Symposium F – Low-Dielectric Constant Materials--Synthesis and Applications in Micro. , 1995 , 153
Copyright
Copyright © Materials Research Society 1995

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

Footnotes

1

U.S. Government work not protected by U.S. copyright

References

[1] Takahashi, A., Nagai, A., Mukoh, A., Wajima, M., and Tsukanishi, K., ”Low dielectric material for multilayer printed wiring boards,” IEEE Trans. Components, Hybrids, and Manufacturing Technology, vol.13, pp. 1115–1120, December 1990.Google Scholar
[2] Jean, J. and Gupta, T. K., ”Design of low dielectric glass+ceramics for multilayer ceramic substrate,” IEEE Trans. Components, Packaging, and Manufacturing Technology-Part B, vol.17, pp. 228–233, May 1994.Google Scholar
[3] Sasaki, A. and Shimada, Y., ”Electrical design technology for low dielectric constant multilayer ceramic substrate,” IEEE Trans. Components, Hybrids, and Manufacturing Technology, vol.15, pp. 56–62, February 1992.Google Scholar
[4] Bahl, I. and Ely, K., ”Modern microwave substrate materials,” Microwave J.vol.33, pp. 131–146, 1990.Google Scholar
[5] Westphal, W. P., ”Techniques of measuring the permittivity and permeability of liquids and solids in the frequency range 3 c/s to 50 kMc/s,” Laboratory for Insulation Research Technical Report XXXVI, MIT, 1950.Google Scholar
[6] Baker-Jarvis, J., Janezic, M. D., John, J. Grosvenor, H., and Geyer, R. G., ”Transmission/reflection and shortcircuit line methods for measuring permittivity and permeability,” Natl. Inst. Stands. Tech. Technical Note 1355, National Institute of Standards and Technology, 1992.Google Scholar
[7] Baker-Jarvis, J., ”Transmission/reflection and short-circuit line permittivity measurements,” Tech. Rep. TN 1341, Natl. Inst. Stands. Tech., July 1990.Google Scholar
[8] Mattar, K. E., Watters, D. G., and Brodwin, M. E., ”Influence of wall contacts on measured complex permittivity spectra at coaxial line frequencies,” IEEE Trans. on Microwave Theory and Tech., vol.39, no.3, p. 532, 1991.Google Scholar
[9] York, R. A. and Compton, R. C., ”An automated method for dielectric constant measurements of microwave substrates,” Microwave J., vol.33, pp. 115–121, March 1990.Google Scholar
[10] Traut, G. R., ”Electrical test methods for microwave pcb's,” Microwave J. vol.24, pp. 73–79, August 1981.Google Scholar
[11] Howell, J. Q., ”A quick, accurate method to measure the dielectric constant of microwave integrated circuits,” IEEE Trans. Microwave Theory Tech., vol. MTT–21, pp. 142–143, March 1973.Google Scholar
[12] Napoli, L. S., ”A simple technique for the accurate determination of microwave dielectric constant for microwave integrated circuits,” IEEE Trans. Microwave Theory Tech., vol. MTT–19, pp. 664–667, July 1971.Google Scholar
[13] Gupta, K. C., Garg, R., and Bahl, I. J., Microwave Lines and Slotlines. Norwood, MA: Artech House, 1979.Google Scholar
[14] Schneider, M. V., ”Microstrip lines for microwave integrated circuits,” Bell Sys. Techn. J., vol., pp. 1421–1444, May-June 1968.Google Scholar
[15] Fidanboylu, K. M., Riad, S. M., and Elshabini-Riad, A., ”A new time-domain approach for determining the complex permittivity using stripline geometry,” IEEE Trans. Instrum. Meas., vol. IM–39, pp. 940–944, December 1990.Google Scholar
[16] Waldron, R. A., ”Theory of a strip-line cavity for measurement of dielectric constants and gyromagnetic resonance line-widths,” IEEE Trans. Microwave Theory Tech., vol. IM–, pp. 123–131, January 1964.Google Scholar
[17] Wheeler, H. A., ”Transmission-line properties of parallel-wide strips separated by a dielectric sheet,” IEEE Trans. Microwave Theory Tech., vol. MTT–13, pp. 172–185, March 1965.Google Scholar
[18] Getsinger, W. J., ”Microstrip dispersion model,” IEEE Trans. Microwave Theory Tech., vol. IM–, pp. 34-, January 1973.Google Scholar
[19] Bahl, I. J. and Stuchly, S. S., ”Analysis of a microstrip covered with a lossy dielectric,” IEEE Trans. Microwave Theory Tech., vol. MTT-28, pp. 104–109, February 1980. 162Google Scholar
[20] Tanaka, H. and Okada, F., ”Precise measurements of dissipation factor in microwave printed circuit boards,” IEEE Trans. Instrum. Meas., vol. IM-38, pp. 509–514, April 1989.Google Scholar
[21] Olyphant, J. Murray and Ball, J. H., ”Stripline methods for dielectric measurements at microwave frequencies,” IEEE Trans. Elec. Insul., vol. EI-5, pp. 26–32, March 1970.Google Scholar
[22] Chang, C. S. and Agrawal, A. P., ”Fine line thin dielectric circuit board characterization,” in 44th Electronic Components and Technology Conference, pp. 564–569, Components, Hybrids and Manufacturing Technology Society, 1994.Google Scholar
[23] “Thin material measurement,” Tech. Rep. Military Specification MIL-P-13949G, 1983.Google Scholar
[24] Das, N. K., Voda, S. M., and Pozar, D. M., ”Two methods for the measurement of substrate dielectric constant,” IEEE Trans. Microwave Theory Tech., vol. MTT-35, pp. 636–641, July 1987.Google Scholar
[25] Traut, G. R., ”Electrical performance of microwave boards,” IEEE Trans. Components, Packaging, and Manufacturing Technology-Part B, vol.18, pp. 106–111, February 1995.Google Scholar
[26] Bringhurst, S. and Iskander, M. F., ”New metallized ceramic coaxial probe for high-temperature broadband dielectric properties of low permittivity materials,” in Microwaves: Theory and Application in Materials ProcessingII, pp. 503–510, Amer. Ceram. Soc.: Ceramics Trans., 1993.Google Scholar
[27] Jenkins, S., Hodgetts, T. E., Symm, G. T., Warhamm, A. G. P., and Clarke, R. N., ”Comparison of three numerical treatments for the open-ended coaxial line sensor,” Elect. Lett., vol.24, pp. 234–235, 1992.Google Scholar
[28] Baker-Jarvis, J. and Geyer, R. G., ”Nondestructive testing with a coaxial probe,” in URSI Digest, URSI, January 1992. Presented atURSI, Boulder, CO.Google Scholar
[29] Zoughi, R. and Lujan, M., ”Nondestructive microwave thickness measurements of dielectric slabs,” Materials Evaluation, vol.48, pp. 1100–1105, 1989.Google Scholar
[30] Baker-Jarvis, J., Janezic, M. D., Domich, P. D., and Geyer, R. G., ”Analysis of an open-ended coaxial probe with lift-off for nondestructive testing,” IEEE Trans. Instrum. Meas., pp. 711–718, October 1994.Google Scholar
[31] Baker-Jarvis, J. and Janezic, M. D., ”The two-port coaxial probe for thin materials (in review),” IEEE Trans, vol., p.,.Google Scholar
[32] Ghodgaonkar, D. K., Varidan, V. V., and Varadan, V. K., ”A free-space method for measurement of dielectric constants and loss tangents at microwave frequencies,” IEEE Trans. Instrum. Meas., vol.37, pp. 789–793, 1989.Google Scholar
[33] Muscil, J. and Zacek, F., Microwave Measurements of Complex Permittivity by Free-Space Methods and Their Applications. New York: Elsevier, 1986.Google Scholar
[34] Ghodgaonkar, D. K., 0. Gandhi, P., and Hagmann, M. J., ”Estimation of complex permittivities of threedimensional inhomogeneous bodies,” IEEE Trans. Microwave Theory Tech., vol. MTT-31, no. 6, pp. 442–446, 1983.Google Scholar
[35] Bolomey, J. C. and Pichot, C., ”Microwave tomography: from theory to practical imaging systems,” Int. J. Imag. Syst. Tech., vol.1, pp. 119–131, 1990.Google Scholar
[36] Arjavalingam, G., Pastol, Y., Halbout, J., and Kopcsay, G. V., ”Broad-band microwave measurements with transient radiation from optoelectronically pulsed antennas,” IEEE Trans. Microwave Theory Tech., vol.38, pp. 615–621, May 1990.Google Scholar
[37] Deutsch, A., ”Measurement of dielectric anisotropy od bpda-pda polyimide in multilayer thin-film packages,” IEEE Trans. Components, Packaging, and Manufacturing Technology-Part B, vol.17, pp. 486–492, November 1994.Google Scholar
[38] Goldfarb, R. B. and Bussey, H. E., ”Method for measuring complex permeability at radio frequencies,” Rev. Sci Instrum., vol.58, no. 4, pp. 624–627, 1987.Google Scholar
[39] Bussey, H. E., ”Measurement of rf properties of materials- a survey,” Proc. IEEE, vol.55, pp. 1046–1053, June 1967.Google Scholar
[40] Jenkins, S., Hodgetts, T. E., Clarke, R. N., and Preece, A. W., ”Dielectric measurements on reference liquids using automatic network analyzers and calculable geometries,” Meas. Sci. Technol., vol.1, pp. 691–702, 1990.Google Scholar
[41] Harris, W. P. and Scott, A. H., ”Precise measurement of dielectric constant by the two-fluid technique,” Conference on Electrical Insulation, 1962.Google Scholar
[42] Mopsik, F. I., ”Two-fluid measurements on thin films,” Tech. Rep. TN 1294, Natl. Inst. Stands. Tech., May 1992.Google Scholar
[43] “New technologies for wide impedance range measurements to 1.8 GHz,” Product note no. 4291–1, Hewlett Packard, 1994.Google Scholar