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Development of Woven Fabric-based Electrical Circuits

  • Anuj Dhawan (a1), Tushar K. Ghosh (a1), Abdelfattah M. Seyam (a1) and John Muth (a2)

Abstract

This paper describes the development of woven electrical circuits, which are formed by interlacing conducting and non-conducting threads into a woven fabric. Conductive threads in these electrical networks are arranged and woven such that they follow desired electrical circuit designs. Electronic devices can be attached to these electrical networks, which can serve as flexible circuit boards. In these woven circuits, an efficient transfer of current from one conductive yarn to an orthogonal one is achieved by the formation of an effective electrical interconnect at the point of intersection of these yarns. Formation of woven conductive networks also involves disconnect formation or cutting of conductive yarns at certain specified points. Different methods and processes were identified and applied in order to form interconnects and disconnects at specified points of these fabrics. Efficacy of these interconnects was evaluated by DC resistance and AC Signal measurements. The results of these evaluations are reported. The conductive threads woven into these fabric-based circuits were also evaluated for signal integrity issues.

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References

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Dhawan, A., Woven fabric-based electrical circuits, Masters Thesis, North Carolina State University, 2001.
Post, E. R., Orth, M., Russo, P. R., and Gershenfeld, N., E-broidery: Design and fabrication of textile-based computing, IBM Systems Journal 39(3 & 4), 840860 (2000).
3. Dhawan, A., Ghosh, T. K., Seyam, A., and Muth, J. F., Woven Fabric-based Electrical Circuits, “Proc. Textile Technology Forum,” IFAI and the Textile Institute, Charlotte, NC, 2002.
4. Lebby, M. S., Jachimowicz, K. E., and Ramdani, J., Textile fabric with integrated sensing device and clothing fabricated thereof, US Patent 6080690 (1998).
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6. Jayaraman, S., Park, S., and Rajamanickam, R., Full-fashioned weaving process for production of a woven garment with intelligence capability, US Patent 6145551 (1998).
7. Garrou, P.E., and Turlik, I., Multichip Module Technology Handbook, (McGraw-Hill, 1998).

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