Skip to main content Accessibility help
×
Home

Determining the High-temperature Properties of Thin Films Using Bilayered Cantilevers

  • H. Tada (a1), P. Nieva (a2), P. Zavracky (a2), I.N. Miaoulis (a1) and P.Y. Wong (a1)...

Abstract

High-temperature applications of microelectromechanical systems (MEMS), especially in new temperature sensor designs, require an accurate knowledge of the temperature-dependent thermophysical properties of the materials. Although the measurement of the mechanical properties of materials at room temperature has been widely conducted, the same techniques often cannot be used for high-temperature property measurements. In this study, a new technique was developed to find the thermal expansion coefficient of thin films at high temperatures. Bilayered cantilever beams undergo thermally induced deflection at high temperatures, which can be measured and correlated to material properties. An imaging system was developed for the experimental measurement of the beam curvature for temperatures up to 1000°C. To find the high-temperature property of thin films, a bilayered beam, consisting of polycrystalline silicon and silicon dioxide, was designed such that the change in the property of SiO2 had little effect on the curvature of the beam. Furthermore, numerical analysis showed that the Young's modulus of Si also had negligible effect on the curvature. Therefore, the analytical model for beam curvature was simplified to be only a function of the thermal expansion coefficient of Si layer. Using this model, the thermal expansion coefficient of polycrystalline Si film was determined for temperature range between room temperature and 1000°C. The method can be easily modified to find the Young's modulus of Si, as well as properties of SiO2.

Copyright

References

Hide All
1. Lai, J., Perazzo, T., Shi, Z., and Majumdar, A., Sensors and Actuators A58, 113119, 1997.
2. Tada, H., Abramson, A. R., Nieva, P., Zavracky, P., Miaoulis, I. N., and Wong, P. Y., to appear inMat. Res. Soc. Symp. Proc. 518, 1998.
3. Obermeier, E., Mat. Res. Soc. Symp. Proc. 444, 3957, 1997.
4. Vlassak, J.J. and Nix, W.D., J. Mater. Res. 7 (12), 32423249, 1992.
5. Ding, X., Ko, W. H., and Mansour, J. M., Sensors and Actuators A21-A23, 866871, 1990.
6. Howe, R. T. and Muller, R. S., Sensors and Actuators 4, 447454, 1983.
7. Townsend, P. H., Barnett, D. M., and Brunner, T. A., J. Appl. Phys. 62 (11), 44384444, 1987.
8. Hong, S., Weihs, T. P., Bravman, J. C., and Nix, W. D., Mat. Res. Soc. Symp. Proc. 130, 9398, 1989.
9. Wolf, S. and Tauber, R. N., Silicon Processing for the VLSI Era, Volume 1 - Process Technology (Lattice Press, Sunset Beach, CA, 1986) p. 199.
10. Tshichiya, T., Tabata, O., Sakata, J., and Taga, Y., J. Microelectromechanical Systems, 7 (1), 106113, 1998.
11. Nieva, P., Zavracky, P. M., Adams, G. G., Tada, H., Abramson, A., Miaoulis, l. N., and Wong, P. Y., accepted for presentation at 5th ASME/JSME Joint Thermal Engineering Conference, San Diego, CA, 1999.
12. Bullis, W. M. and Huff, H. R., in The Encyclopedia of Advanced Materials, Volume 4 edited by Bloor, D., Brooke, R. J., Cahn, R. W., Flemings, M. C., and Mahajan, S. (Elsevier ScienceLtd., Oxford, England, 1994) p. 2491

Metrics

Full text views

Total number of HTML views: 0
Total number of PDF views: 0 *
Loading metrics...

Abstract views

Total abstract views: 0 *
Loading metrics...

* Views captured on Cambridge Core between <date>. This data will be updated every 24 hours.

Usage data cannot currently be displayed