Hostname: page-component-8448b6f56d-dnltx Total loading time: 0 Render date: 2024-04-19T12:58:04.103Z Has data issue: false hasContentIssue false

Deposition of a-SiC:H Using Organosllanes in an Argon/;Hydrogen Plasma

Published online by Cambridge University Press:  22 February 2011

Leon Maya*
Affiliation:
Chemical and Analytical Sciences Division, Oak Ridge National Laboratory, P.O.B. 2008, Oak Ridge, TN 37831-6119
Get access

Abstract

Selected organosilanes were examined as precursors for the deposition of amorphous hydrogenated silicon carbide in an argon/hydrogen plasma. The effect of process variables on the quality of the films was established by means of FTIR, Auger spectroscopy, XPS, XRD, chemical analysis, and weight losses upon pyrolysis. For a give power level there is a limiting feeding rate of the precursor under which operation of the system is dominated by thermodynamics and leads to high quality silicon carbide films that are nearly stoichiometric and low in hydrogen. Beyond that limit, carbosilane polymer formation and excessive hydrogen incorporation takes place. The hydrogen content of the plasma affects the deposition rate and the hydrogen content of the film. In the thermodynamically dominated regime the nature of the precursor has no effect on the quality of the film, it affects only the relative utilization efficiency.

Type
Research Article
Copyright
Copyright © Materials Research Society 1994

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1. Tawada, Y., Tsuge, K., Kondo, M., Okamoto, H., and Hamakawa, Y., J. Appl. Phys. 53, 5273 (1982).Google Scholar
2. Kruangam, D., Endo, T., Guang-Pu, W., Okamoto, H., and Hamakawa, Y., Jpn. J. Appl. Phys. 24, L806 (1985).Google Scholar
3. Jean, A., Chaker, M., Diawara, Y., Leung, P.K., Gat, E., Mercier, P.P., Pepin, H., Gujrathi, S., Ross, G.G., and Kieffer, J.C., J. Appl. Phys. 72, 3110 (1992).Google Scholar
4. Anderson, D.A., and Spear, W.E., Philos. Mag. 35, 1 (1977).Google Scholar
5. Gat, E., Khakani, M.A. El, Chaker, M., Jean, A., Boily, S., Pepin, H., Kieffer, J.C., Durand, J., Cross, B., Rousseaux, F., and Gujrathi, S., J. Mater. Res. 7, 2478 (1992).Google Scholar
6. Efstathiadis, H., Yin, Z., and Smith, F.W., Phys. Rev. B46, 13119 (1992).Google Scholar
7. Brodsky, M.H., Cardona, M., and Cuomo, J.J., Phys. Rev. B16, 3556 (1977).Google Scholar
8. Guivarc'h, A., Richard, J., Contellec, M. Le, Ligeon, E., and Fontenille, J., J. Appl. Phys. 51, 2167 (1980).Google Scholar
9. Magafas, L., Georgoulas, N., Girginoudi, D., and Thanailakis, A., J. Non-Cryst. Solids, 139, 146 (1992).Google Scholar
10. Vasile, M.J., and Smolinsky, G., J. Electrochem. Soc. 119, 451 (1972).Google Scholar
11. Weidman, T.W., and Joshi, A.M., Appl. Phys. Lett. 62, 372 (1993).Google Scholar
12. Duff, R.E., and Bauer, S.H., J. Chem. Phys. 36, 1754 (1962)Google Scholar
13. Muehloff, L., Choyke, W.J., Bozac, M.J., and Yates, J.T. Jr., J. Appl. Phys. 60, 2842 (1986).Google Scholar
14. Mogab, C.J., and Kingery, W.E., J. Appl. Phys. 39, 3640 (1968).Google Scholar