Hostname: page-component-7bb8b95d7b-495rp Total loading time: 0 Render date: 2024-09-23T07:07:56.250Z Has data issue: false hasContentIssue false
  • English
  • Français

Deformation in Thin Films Deposited on Rigid Substrates

Published online by Cambridge University Press:  22 February 2011

Masanori Murakami
Masanori Murakami*
Affiliation:
IBM Research Division, T. J. Watson Research Center,Yorktown Heights, New York 10598
Get access

Abstract

Stresses and strains are always present in thin films deposited on rigid substrates. They are introduced into the films during the deposition and/or subsequent heat and chemical treatments. Since the origins of the strains (stresses) in thin films and their shapes are different from those of bulk materials, the distribution of strains supported elastically by the films is different from that of the bulk materials. The present paper reviews deformation in thin films caused by elastic strains, using illustrative data of Pb and Nb films that were deposited on Si wafers. Also, x-ray diffraction techniques to detect such local deformation are briefly reviewed.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 130: Symposium C – Thin Films: Stresses and Mechanical Properties I , 1988 , 269
Copyright
Copyright © Materials Research Society 1989

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1. Klokholm, E. and Berry, B.S., J. Electrochem Soc. 115, 823 (1968).CrossRefGoogle Scholar
2. Doerner, M.F. and Nix, W.D., CRC Critical Rev. in Sol. Stat. and Mat. Sci. 14,225 (1988).CrossRefGoogle Scholar
3. Hoffman, R.W., “Physics of Nonmetallic Thin Films”, eds. Dupuy, H.S. and Cachard, A., Plenum Press, New York (1974).Google Scholar
4. Chopra, K.L., “Thin Film Phenomena”, McGraw-Hill, New York (1969).Google Scholar
5. F.M. d'Heurle, Int. Met. Rev. (in press)Google Scholar
6. Murakami, M., CRC Critical Rev. in Sol. Stat. and Mat. Sci. 11,317 (1984).CrossRefGoogle Scholar
7. Murakami, M. and Chaudhari, P., Thin Solid Films 46, 109 (1977).CrossRefGoogle Scholar
8. Murakamami, M., Acta Metall. 26, 175 (1978).CrossRefGoogle Scholar
9. Murakami, M. and Yogi, T., J. Appl. Phys. 57,211 (1985).CrossRefGoogle Scholar
10. Murakami, M., Thin Solid Films 69, 253 (1980)CrossRefGoogle Scholar
11. Murakami, M., J. Appl. Phys. 53, 3560 (1982).10.1063/1.331135CrossRefGoogle Scholar
12. Murakami, M., Kuan, T. S. and Blech, I. A., Treat. Mat. Sci. Technol. 24, 163 (1982).10.1016/B978-0-12-341824-1.50010-0Google Scholar
13. Cambell, D. S., “Handbook of Thin Film Technology”, eds. Maissel, L. I. and Glang, R., McGraw-Hill, New York (1983).Google Scholar
14. Segmuller, A. and Murakami, M., Treat. Mat. Sci. Technol. 27, 143 (1988).Google Scholar
15. Nye, J.F., “Physical Properties of Crystals”, University Press, Oxford (1972).Google Scholar
16. Vook, R.W., and Witt, F., J. Appl. Phys. 36, 2169 (1965).10.1063/1.1714442CrossRefGoogle Scholar
17. Waldord, D.L. and Alers, G.A., J. Appl. Phys. 33, 3266 (1962).10.1063/1.1931149CrossRefGoogle Scholar
18. Murakami, M., J. Appl. Phys. 52, 1309 (1981)CrossRefGoogle Scholar
19. Bolef, D.I. and Menes, M., Bull. Am. Phys. Soc. 5, 40 (1960)Google Scholar
20. Houska, C.R., Treat. Mat. Sci. Technol. 19A, 63 (1980)Google Scholar
21. Van der Herwe, J.H., Proc. Conf. Single Crystal Films, Pergomon Press, New York (1964).Google Scholar
22. Warren, B. E., “X-ray Diffraction”, Addison-Wesley, Reading, (1968).Google Scholar