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Deformable interconnects for conformal integrated circuits

Published online by Cambridge University Press:  11 February 2011

Stéphanie Périchon Lacour ,
Zhenyu Huang ,
Zhigang Suo  and
Sigurd Wagner
Stéphanie Périchon Lacour
Affiliation:
Department of Electrical Engineering, Princeton University, Princeton NJ 08544
Zhenyu Huang
Affiliation:
Department of Mechanical & Aerospace Engineering and Princeton Material Institute, Princeton University, Princeton NJ 08544
Zhigang Suo
Affiliation:
Department of Mechanical & Aerospace Engineering and Princeton Material Institute, Princeton University, Princeton NJ 08544
Sigurd Wagner
Affiliation:
Department of Electrical Engineering, Princeton University, Princeton NJ 08544
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Abstract

The electro-mechanical response of thin gold layers evaporated onto silicone substrates is reported. Gold layers are prepared either thin and flat or thin and wavy on the compliant substrate. The electrical resistance of gold/silicone stripes is measured and analyzed during tensile deformation. For a 100-nm thick gold layer evaporated on a 1-mm thick silicone membrane, we have observed electrical continuity up to ∼ 22 % strain. This maximum strain decreases when the gold layer thickness is raised.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 736: Symposium D – Electronics on Unconventional Substrates–Electrotextiles and Giant-Area Flexible Circuits , 2002 , D4.8
Copyright
Copyright © Materials Research Society 2003

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References

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