TMOS devices for power applications use ion-implantation for doped layers. Implant-damage can increase electrical leakage of devices. Transmission electron microscopy was used to study the effect of dose (4E14 - 2E15 cm- 2) and energy (20-40 keV) of p+ implants on damage related to leakage in TMOS structures. TEM reveals a high density of boron implant-induced defects such as end-of-range and peak-of-implant damage, boron implant-induced stacking faults and dislocations. End-of-range defects also arise from an arsenic implant, and mask-edge defects arise where arsenic-amorphized Si and crystalline Si meet in the source region. Some defects extend >0.5 μπι into the substrate. The density and the extent of defect penetration decrease with decreasing implant-dose and energy. These data correlate well with the electrical data, which show that Idss leakage decreases with decreasing p+ implant-energy and dose.