Skip to main content Accessibility help
×
Home

Damage Induced By A Low-Biased 92-MHz Anode-Coupled Reactive Ion Etcher Using Chlorine-Nitrogen Mixed Plasmas

  • Tadashi Saitoh (a1), Hideki Gotoh (a1), Tetsuomi Sogawa (a1) and Hiroshi Kanbe (a1)

Abstract

Dry-etch damage, introduced by a low biased 92-MHz anode-coupled reactive ion etching (RIE), in MBE-grown undoped GaAs has been characterized by photoreflectance (PR) and photoluminescence (PL) measurements. PL spectra show emission peaks at 1.516 eV (excitons) and at 1.494 eV (D-A, B-A) before etching, whereas a new emission peak at around 1.488–1.490 eV appears after the RIE. The depth distribution of this new emission center, examined by PL measurements with a combination of step wet etching, has a Gaussian-shape with a l/e value of 56 nm. A very small number of nonradiative recombination centers are considered to be generated, because the integrated PL intensity including both emission peaks at 1.490 eV and at 1.516 eV is the same before and after the RIE. The surface recombination rate of the sidewall formed by the RIE is almost the same as that of the wet-etched surface. This low-damage etching has been applied to fabricate ultra-fine GaAs patterns to provide a nanometer-scale ridge structure with a cross-section 15-nm wide by 150-nm high. The low damage etching condition is also suitable for precise fabrication.

Copyright

References

Hide All
[1] Kuske, J., Stephan, U., Schde, K., andFuhs, W., Mat. Res. Soc. Sump. Proc., 258, 141 (1992).
[2] Goto, H. H., Sasaki, M., Ohmi, T., Yamagami, A., Okamura, N., and Kamiya, O., IEEE Trans. Semicon. Manufac., 4, 111 (1991).
[3] Nakanishi, H. and Wada, K., The 57th Fall Meeting of Jpn. Soc. Appl. Phys., 7p-ZK-14 (1996) (Japanese).
[4] Nakanishi, H. and Wada, K., The 55th Spring Meeting of Jpn. Soc. Appl. Phys., 30p-ZD-2 (1994) (Japanese).; Mat. Res. Soc. Sump. Proc., 324, 161 (1994).
[5] Williams, E. W. and Bebb, H. B., Semiconductors and Semimetals, vol.8, edited by Willardson, R. K. and Beer, A. C. (Academic Press, New York, 1972), Chap. 5.
[6] Lauruelle, F., Bagchi, A., Tsuchiya, M., Merz, J., and Petroff, P. M., Appl. Phys. Lett., 56, 1561 (1990).
[7] Kanayama, T., Takeuchi, Y., andSugiyama, Y., Inst. Phys. Conf. Ser., No. 129, 573 (1992).
[8] Stoffel, N. G., Schwarz, S. A., Pudensi, M. A. A., Kash, K., Florez, L. T., Habison, J. P., and Wilkens, B. J., Appl. Phys. Lett., 60, 1603 (1992).
[9] Rahman, M., Foad, M. A., Hicks, S., Holland, M. C., and Wilkinson, C. D. W., Mat. Res. Soc. Sump. Proc., 279, 775 (1993).
[10] Green, D. L., Hu, E. L., and Stofell, N. G., J. Vac. Sci. Technol. B, 12, 3311 (1994).
[11] Chen, C. H., Green, D. L., Hu, E. L., Ibbetson, J. P., and Petroff, P. M., Appl. Phys. Lett., 69, 58 (1996).
[12] Maile, B. E., Forchel, A., Germann, R., and Grutzmacher, D., Appl. Phys. Lett., 54, 1552 (1989).
[13] Saitoh, T. and Kanbe, H., Jpn. J. Appl. Phys., Pt. 2, 35, L60 (1996).

Damage Induced By A Low-Biased 92-MHz Anode-Coupled Reactive Ion Etcher Using Chlorine-Nitrogen Mixed Plasmas

  • Tadashi Saitoh (a1), Hideki Gotoh (a1), Tetsuomi Sogawa (a1) and Hiroshi Kanbe (a1)

Metrics

Full text views

Total number of HTML views: 0
Total number of PDF views: 0 *
Loading metrics...

Abstract views

Total abstract views: 0 *
Loading metrics...

* Views captured on Cambridge Core between <date>. This data will be updated every 24 hours.

Usage data cannot currently be displayed