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The Copper Corrosion and Sulfur Contamination Generated by a Three-Step Copper Chemical-Mechanical Polishing Process

  • Chun-Ping Liu (a1), Yen-Shih Ho (a2), Tien-Chen Hu (a3) and Bae-Heng Tseng (a4)


This article shows the root cause of Cu corrosion and sulfur contamination due sulfite vapor reflow through drainpipe of load cup to the original three-step Cu CMP equipment. Now, we provide a solution which to modify the arrangement of the drainpipe in original three-step Cu CMP equipment. This is an effective implement for reduction the defects of Cu corrosion and sulfur contamination from long-term observations.



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4 Guha, S., Sethuraman, A., Gotkis, Y., Kistler, R. and Steckenrider, S., Solid State Technology 44–4, (2001).



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